After TSMC fab in Japan, advanced packaging facility is next 2024-03-18 15:13:00 Commentary / Analysis
A System On Module (SoM) developed by Electra IC: BitFlex-SPB-A7 FPGA SoM 2024-03-18 13:08:00 Embedded Systems
QuickLogic and Zero-Error Systems Partner to Deliver Radiation-Tolerant eFPGA IP for Commercial Space Applications 2024-03-14 16:46:00 IP
PrimisAI Unveils Premium Version of RapidGPT, Redefining Hardware Engineering 2024-03-14 07:46:00 EDA
Arteris Expands Ncore Cache Coherent Interconnect IP To Accelerate Leading-Edge Electronics Designs 2024-03-13 16:15:00 IP
Arm's Broadest Ever Automotive Enhanced IP Portfolio Designed for the Future of Computing in Vehicles 2024-03-13 15:19:00 IP
HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce 2024-03-13 13:21:00 Commentary / Analysis
Siemens to demonstrate first pre-silicon simulation environment for Arm Cortex-A720AE for Software Defined Vehicles 2024-03-13 08:45:00 Embedded Systems
Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem 2024-03-13 07:49:00 Business
Ecosystem Collaborations Bring Full Stack Software Solutions to Develop Leading-edge Automotive Applications From Day One 2024-03-13 07:26:00 Embedded Systems