PQShield achieves first FIPS 140-3 certification
2024-10-07 12:56:00
SoC Architecture & Assembly
Chiplet News Archive - Page 90 of 1944
intoPIX to Showcase Innovative Automotive Imaging Solutions at AutoSens Europe 2024
2024-10-07 12:30:00
Misc
UMC Reports Sales for September 2024
2024-10-07 09:17:00
Financials
GUC Monthly Sales Report - September 2024
2024-10-07 08:39:00
Financials
Global Semiconductor Sales Increase 20.6% Year-to-Year in August
2024-10-07 07:49:00
Analysis & Insight
Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
2024-10-07 01:00:00
Misc
Launching MosChip DigitalSky™ for Building Connected Intelligent Enterprises
2024-10-03 18:33:00
Misc
Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs
2024-10-03 11:16:00
Commercial Deals
Xiphera Partners with IPro for the Israeli Chip Design Market
2024-10-03 11:02:00
Strategic Partnerships
Siemens collaborates with GlobalFoundries to certify Analog FastSPICE for the foundry's high-performance processes
2024-10-02 17:04:00
EDA & Design Tools
EXTOLL collaborates with Frontgrade Technologies for High-Speed SerDes IP
2024-10-02 09:53:00
Commercial Deals
Achronix Releases Groundbreaking Speedster AC7t800 Mid-Range FPGA, Driving Innovation in AI/ML, 5G/6G and Data Center Applications
2024-10-02 09:28:00
SoC Architecture & Assembly
BrainChip Introduces Lowest-Power AI Acceleration Co-Processor
2024-10-01 16:37:00
IP Cores & Design
Comcores announces the launch of the Centralized Network Configurator for TSN-based networks
2024-10-01 13:43:00
IP Cores & Design
RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs
2024-10-01 13:00:00
IP Cores & Design
QuickLogic Delivers eFPGA IP Targeting TSMC N12e Process in Record Time
2024-10-01 11:19:00
IP Cores & Design
MulticoreWare collaborates with Arm to optimize and advance x265 video encoding on AWS Graviton4
2024-10-01 08:42:00
SoC Architecture & Assembly
Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology
2024-09-30 14:14:00
IP Cores & Design
Qualcomm and Sequans Complete Sale of 4G IoT Technology
2024-09-30 12:41:00
Strategic Partnerships
Paul Williamson on Edge AI, Llama 3.2 on Arm
2024-09-30 09:14:00
Analysis & Insight