Egis Technology Partners with ASICLAND to Accelerate Global AI HPC Server Chip Deployment

November 5, 2024, Taipei -- Egis Technology has signed a strategic partnership agreement with South Korean chip design company, ASICLAND Co., Ltd., to co-develop AI HPC Server Chiplet designs. This collaboration encompasses multiple key technologies, including CPU Die, AI Die, IO Die, IP licensing (such as UCIe, LPDDR5, PCIE5/6), and advanced CoWoS packaging development, all aimed at the high-end data center market.

The initial phase will focus on developing an IO Die, combining Egis’s UCIe and LPDDR5 IP with ASICLAND’s ASIC chip design expertise and TSMC’s 7nm process technology, integrated through Alcor Micro’s advanced CoWoS packaging. This joint effort will deliver a comprehensive advanced IO Chiplet solution. By merging technical strengths, Egis and ASICLAND aim to strengthen their global competitiveness, initially targeting the Korean market with plans to expand internationally in the future.

About ASICLAND

Founded in 2016, ASICLAND is a listing IC design company in South Korea and the only official TSMC Value Chain Alliance (VCA) partner in the country. ASICLAND is also an Arm Total Design Partner, providing comprehensive solutions from SoC semiconductor architecture design to circuit design and verification.

As a key partner of global semiconductor leader which is Arm, Egis Technology joined the Arm Total Design initiative in September to drive AI HPC Server products using TSMC’s advanced processes. This collaboration with ASICLAND marks a significant step towards cutting-edge manufacturing processes.