Ceva Expands its Market Share Leadership in Wireless Connectivity IP, Strengthening its Solutions for Smart Edge AI/IoT applications 2024-08-13 08:03:00 Other
Agnisys Joins Arm Partner Program and Releases Solution Brief for Functionally Safe Arm-Based SoC Design 2024-08-12 17:53:00 Other
Linux Foundation Welcomes the Open Model Initiative to Promote Openly Licensed AI Models 2024-08-12 17:26:00 Other
AMD Completes Acquisition of Silo AI to Accelerate Development and Deployment of AI Models on AMD Hardware 2024-08-12 17:23:00 Business
Fraunhofer IPMS remains important research partner for GlobalFoundries Dresden 2024-08-12 12:53:00 Other
Qualitas Semiconductor Expands Licensing Agreement with Key South Korean Fabless company 2024-08-12 10:28:00 Deals
Secure-IC signs International Collaboration with Taiwan Quantum Safe Association and PQC-CIA 2024-08-12 09:41:00 Other
16-Bit, 5MSPS SAR ADC IP Core Silicon-Proven: Delivers Superior Dynamic Performance with Flexible Resolution Modes for Next-Generation Applications 2024-08-12 03:00:00 Other
NVM Express Releases NVM Express Specifications to Unify AI, Cloud, Client, and Enterprise Storage 2024-08-07 10:50:00 Other
ZeroPoint Technologies introduces LZ4 Compression and Decompression Hardware IP 2024-08-05 20:45:00 IP
Global Semiconductor Sales Increase 18.3% in Q2 2024 Compared to Q2 2023; Quarter-to-Quarter Sales Up 6.5% 2024-08-05 18:06:00 Commentary / Analysis
NEO Semiconductor Announces the Development of its 3D X-AI Chip; Targeted to Replace Existing HBM Chips and Solve Data Bus Bottlenecks 2024-08-05 17:31:00 Chip