Silex Insight launches the all-new VIPER (4K60 4:4:4 AV over IP transmitter/receiver board), ideal for collaboration featuring seamless switching between multiple inputs (2xHDMI/1xUSB-C)
2021-06-10 14:29:00
SoC Architecture & Assembly
Chiplet News Archive - Page 304 of 1945
TSMC May 2021 Revenue Report
2021-06-10 13:27:00
Financials
Xilinx Acquires Silexica to Broaden its Developer Base
2021-06-10 13:22:00
Strategic Partnerships
Hardent VESA DSC and FEC IP Cores Licensed by Kinetic Technologies
2021-06-10 10:53:00
Commercial Deals
Global Semiconductor Sales Increase 1.9% Month-to-Month in April; Annual Sales Projected to Increase 19.7% in 2021, 8.8% in 2022
2021-06-10 10:41:00
Analysis & Insight
Bosch opens wafer fab of the future in Dresden
2021-06-10 10:05:00
Foundries & Process Nodes
Creonic to Offer End-to-end IP-over-Satellite Solutions
2021-06-10 08:52:00
IP Cores & Design
Samsung Successfully Completes 8nm RF Solution Development to Strengthen 5G Communications Chip Solutions
2021-06-10 08:48:00
Foundries & Process Nodes
Xilinx Extends Edge Compute Leadership with World's Highest AI Performance-per-Watt
2021-06-10 05:41:00
SoC Architecture & Assembly
IBM, GlobalFoundries in Breach-of-Contract Spat
2021-06-09 16:04:00
Analysis & Insight
TSMC's Chip Scaling Efforts Reach Crossroads at 2nm
2021-06-09 15:57:00
Analysis & Insight
AndesBoardFarm Enables SoC Designers to Explore RISC-V Processors in Online FPGA Board Collection
2021-06-09 15:26:00
SoC Architecture & Assembly
OPENEDGES and The Six Semi Announce Silicon Proven GDDR6 PHY in 12nm Process Technology
2021-06-09 07:53:00
IP Cores & Design
Automotive IC Marketshare Slips in 2020 After Steady Gains Since 1998
2021-06-09 07:51:00
Analysis & Insight
New Cadence Allegro X Design Platform Revolutionizes System Design
2021-06-09 07:47:00
EDA & Design Tools
Xylon Releases a Complete Multi-Channel HDR ISP IP Suite
2021-06-08 15:42:00
IP Cores & Design
Synopsys Acquires Code Dx to Extend Application Security Portfolio
2021-06-08 15:07:00
Strategic Partnerships
Arteris IP FlexNoC Interconnect & Resilience Package Again Licensed by Black Sesame for ISO 26262-Compliant Automotive ADAS Chips
2021-06-08 14:21:00
Commercial Deals
GLOBALFOUNDRIES and GlobalWafers Partnering to Expand Semiconductor Wafer Supply
2021-06-08 08:34:00
Foundries & Process Nodes
GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Technology Validating 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and 112G-LR SerDes IPs
2021-06-08 08:25:00
IP Cores & Design