Mythic Expands Product Lineup with New Scalable, Power-Efficient Analog Matrix Processor for Edge AI Applications 2021-06-08 08:06:00 SoC Architecture & Assembly
Siemens acquires proFPGA product family from PRO DESIGN to expand industry-leading IC verification portfolio 2021-06-08 06:25:00 Strategic Partnerships
Palma Ceia SemiDesign Announces New Wi-Fi HaLow Chips, PCS2100 and PCS2500 - Ideal for Industry 4.0 2021-06-07 12:27:00 SoC Architecture & Assembly
Synopsys Expands Multi-Die Solution Leadership with Industry's Lowest Latency Die-to-Die Controller IP 2021-06-03 15:13:00 IP Cores & Design
intoPIX delivers JPEG XS Compressed Solutions for Low Latency Video Streaming with NVIDIA GPUs 2021-06-03 10:57:00 SoC Architecture & Assembly
Sondrel launches the fourth IP platform - SFA 350A - that delivers faster time to market for ADAS ASICs 2021-06-03 09:39:00 IP Cores & Design
Brite Semiconductor Releases ONFI 4.2 IO and Physical Layer IP based on SMIC 14nm FinFET Process 2021-06-03 09:28:00 IP Cores & Design
SmartDV Announces Support for ARINC Standards with Design and Verification IP 2021-06-03 07:18:00 IP Cores & Design
Siemens enhances Nucleus ReadyStart for Arm platforms with enhanced debug, security and stability features 2021-06-03 06:09:00 SoC Architecture & Assembly
EdgeCortix Collaborates with Cadence to Accelerate AI Chip Design 2021-06-03 01:14:00 EDA & Design Tools
Arm empowers MCU software developers to capitalize on IoT potential 2021-06-02 15:39:00 SoC Architecture & Assembly
PLDA and AnalogX Announce Market-leading CXL 2.0 Solution featuring Ultra-low Latency and Power 2021-06-02 13:26:00 IP Cores & Design
NXP Ramps Automotive Processing Innovation with Two Processors on TSMC 16nm FinFET Technology 2021-06-02 13:22:00 Foundries & Process Nodes
PUFsecurity and Andes Technology Cooperate to Integrate Crypto Coprocessor PUFiot into RISC-V AIoT Security Platform 2021-06-02 09:27:00 IP Cores & Design