AccelerComm join the O-RAN ALLIANCE to improve interoperability and maximize spectral efficiency 2020-12-17 11:24:00 Other
Nimbix Announces First Multi-cloud HPC Platform With Support For Arm 2020-12-17 11:21:00 Embedded Systems
Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs 2020-12-17 07:52:00 EDA
AIStorm Raises $16M in Oversubscribed Series B Funding to Commercialize AI-in-Sensor Chips 2020-12-16 09:07:00 Business
Sofics and Hardent join Mixel's MIPI ecosystem to provide designers a complete MIPI solution 2020-12-15 17:16:00 Business
Blaize Delivers First Open and Code-free AI Software Platform Spanning the Entire Edge AI Application Lifecycle 2020-12-14 13:52:00 Embedded Systems
Lattice Propel Accelerates Time-to-Market for Embedded Processor-based Designs on Latest Nexus Platform FPGAs 2020-12-14 13:44:00 FPGA
Synthara targets breakthrough edge-AI chips with support from a global coalition of investors and R&D partners 2020-12-14 09:08:00 Business