Qualcomm, MediaTek Fill Vacuum HiSilicon Left in Smartphones
By Alan Patterson, EETimes (June 15, 2021)
Qualcomm and MediaTek have plugged the gap that Huawei left when the US government effectively forced Huawei subsidiary HiSilicon out of the smartphone chip business last year as part of the trade war between China and the US.
Chinese government-backed Huawei and its chip-design unit HiSilicon were at the top of the heap in the world’s smartphone business and were poised to dominate the 5G business just as the administration of former US President Donald Trump banned chip foundry Taiwan Semiconductor Manufacturing Co. (TSMC) from supplying semiconductors to HiSilicon.
At this time last year, HiSilicon accounted for about 15 percent of TSMC’s sales, making the chip designer the second-largest TSMC customer after Apple. Now, TSMC no longer supplies chips to HiSilicon, and that left a huge gap open to Qualcomm and MediaTek.
To read the full article, click here
Related Semiconductor IP
- Lightweight and Configurable Root-of-Trust Soft IP
- Message filter
- SSL/TLS Offload Engine
- TCP/UDP Offload Engine
- JPEG-LS Encoder IP
Related News
- InvenSense Provides High-Accuracy Turn-By-Turn Navigation User Experience To HiSilicon Mobile Platforms And Huawei Smartphones
- MediaTek Introduces Helio P25 Premium Performance Chip For Dual-Camera Smartphones
- Qualcomm, Samsung, Mediatek Offer Hints on iPhone 8
- Global Top Ten IC Design Companies Ranked by Revenue; Only Qualcomm and MediaTek Suffered Decreases
Latest News
- Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium
- Cadence Advances AI in the Cloud with Industry-First DDR5 12.8Gbps MRDIMM Gen2 Memory IP System Solution
- RIVAI Launched China’s First Fully Self-Developed High- Performance RISC-V Server Chip
- Equal1 advances scalable quantum computing with CMOS-compatible silicon spin qubit technology
- TSMC Reports First Quarter EPS of NT$13.94