EU-Funded NimbleAI to Deliver 3D Neuromorphic Chip
Anne-Françoise Pelé, EETimes Europe (April 27, 2023)
Leveraging inspiration from biology combined with AI advances, the EU-funded NimbleAI project aims to unlock the potential of neuromorphic vision. French eFPGA IP company Menta announced it has joined the NimbleAI consortium to help design a 3D neuromorphic chip.
NimbleAI is a three-year, €10 million research project funded by the EU’s Horizon Europe research and innovation program. Its objective is to develop a neuromorphic sensing and processing 3D silicon stacked architecture in which sensing, memory, communications and processing are physically fused and where precision, energy, resources and time are dynamically traded off to enhance overall perception.
To read the full article, click here
Related Semiconductor IP
- Four-Wire slave IP for use with the Mentor M8051W and M8051EW
- Two-Wire slave IP for use with the Mentor M8051W and M8051EW
Related News
- SynSense closes strategic round to accelerate the development of their high-speed 3D neuromorphic processor DYNAP™-CNN2
- NEO Semiconductor Announces the Development of its 3D X-AI Chip; Targeted to Replace Existing HBM Chips and Solve Data Bus Bottlenecks
- 3-D FPGAs enable silicon convergence
- GLOBALFOUNDRIES Fab 8 Adds Tools To Enable 3D Chip Stacking at 20nm and Beyond
Latest News
- 2025 TSMC OIP Ecosystem Forum Highlights Aion Silicon’s Leadership in Advanced SoC Design
- Ceva Appoints Former Microsoft AI and Hardware Leader Yaron Galitzky to Accelerate Ceva’s AI Strategy and Innovation at the Smart Edge
- Dnotitia Unveils VDPU IP, the First Accelerator IP for Vector Database
- Ambient Scientific AI-native processor for edge applications offers 100x power and performance improvements over 32-bit MCUs
- Qualitas Semiconductor Signs PCIe Gen 4.0 PHY IP License Agreement with Leading Chinese Fabless Customer