TSMC's 3-nm Push Faces Tool Struggles
By Alan Patterson, EETimes (April 25, 2023)
Taiwan Semiconductor Manufacturing Co. (TSMC) is straining to meet demand from top customer Apple for 3-nm chips. The company’s tool and yield struggles have impeded the ramp to volume production with world-leading technology, according to analysts surveyed by EE Times.
TSMC and Samsung, its next largest rival in the foundry business, are racing to be first in 3-nm production for customers like Apple and Nvidia in high-performance computing (HPC) and smartphones. TSMC became the latest to claim 3-nm leadership in its quarterly results announcement last week.
To read the full article, click here
Related Semiconductor IP
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
- TSMC 3nm (N3E) 1.8V SD/eMMC IO
- TSMC 3nm UCIe-A 32G Die to Die Interface
- TSMC 3nm HBM3-8.6G PHY
Related News
- Cadence Selected as Primary EDA Tool Vendor by GLOBALFOUNDRIES
- Siemens announces EDA milestones and tool certifications for TSMC's latest process technologies
- Diakopto Unleashes Breakthrough ParagonX EDA Tool, Platform and Methodology to Dramatically Accelerate IC Design Debugging and Optimization
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
Latest News
- Secure-IC, now a part of Cadence, unveils Securyzr™ Xperience, an Exclusive Gateway to Security Innovation
- QuickLogic Accelerates Space Innovation with Secure, Customizable eFPGA Hard IP
- SkyWater Technology and QuamCore Announce Collaboration to Fabricate Digital Superconducting Controller for Scalable Quantum Computing
- Aion Silicon Expands Barcelona Design Center to Meet Surging Demand for ASIC and SoC Solutions
- UMC Reports Sales for October 2025