eASIC Integrates Front-End from Interra to Accelerate Deployment of Nextreme Structured ASICs
2008-03-04 21:08:00
EDA
Chiplet News Archive - Page 1313 of 1940
WiLinx Licenses Tensilica's Xtensa LX2 Processor Core For Low-Power UWB Chips
2008-03-04 14:35:00
Deals
Xilinx Accelerates Development of SFI-5 Applications With Hardware-Verified Solutions
2008-03-04 14:31:00
FPGA
OCP-IP Unveils CoreCreator II
2008-03-04 14:15:00
EDA
Silvus Technologies Announces Commercial Availability of 802.11n PHY IP Solution
2008-03-03 16:46:00
IP
ARC Helps STEC's New MACH4 Compact Flash Capture HD Multimedia Content at Twice the Speed Of Competitive Offerings
2008-03-03 14:25:00
Deals
OCP-IP Announces Part 1 of Network On Chip Benchmarking Specification
2008-03-03 14:11:00
Other
Imperas Unleashes Open Source Initiative to Establish Common, Open Standard for Multicore SoC Design
2008-03-03 13:48:00
Embedded Systems
Faraday and Mixel Announce IP Development and Licensing Partnership
2008-03-03 13:38:00
Business
Convergence of Graphics, Video and GPS to Drive Next Generation Personal Navigation Devices
2008-03-03 12:21:00
Business
ViASIC Names J. Mark Goode as President and Chief Executive Officer
2008-03-03 11:52:00
People
Tensilica and NuFront to Show T-MMB Mobile TV Solution at China's IIC 2008 Shows
2008-03-03 09:16:00
Other
Patriot Scientific Names Chip Industry Veteran as Chief Executive Officer
2008-02-29 14:29:00
People
TSMC Announces Reorganization to Improve Structural Profitability and Strengthen Customer Partnership
2008-02-29 11:39:00
Foundries
Mentor Graphics Reports Fiscal Fourth Quarter 2008 Results
2008-02-28 22:00:00
Financial
Tundra's SLE Division Announces Market's First 150 Gb/s Interlaken IP Core
2008-02-28 15:43:00
IP
InterDigital Licenses 3G Modem Technology to Leading Asian Semiconductor Company
2008-02-28 15:17:00
Deals
Think Silicon announces IP Partnership programme
2008-02-28 15:02:00
Other
Tensilica Configurable Processors Used in Stanford Smart Memories Project
2008-02-28 14:48:00
Other
Magma Introduces Titan -- First Platform to Combine Full-Chip, Mixed-Signal, Analysis and Verification for IC Design
2008-02-28 03:05:00
EDA