ViASIC Names J. Mark Goode as President and Chief Executive Officer
RESEARCH TRIANGLE PARK, N.C.-- March 3, 2008
--ViASIC Inc., an electronic design automation (EDA) company that offers breakthrough tools, IP and services for reconfigurable semiconductor fabrics, today announced the promotion of J. Mark Goode to president and chief executive officer, effective immediately. Goode brings 17 years of solid experience to this role, spanning strategic marketing, business development and corporate management. He previously served as vice president of business development at ViASIC, and continues to serve on the board of directors.
Lynn Hayden, chairman of the board, and formerly president and chief executive officer at ViASIC, said, “With his broad skills and keen business acumen, Mark Goode is the ideal person to guide ViASIC through its business development and next phase of growth. ViASIC continues to add value for its customers in the radiation hardened market with its configurable technology and will apply this capability more broadly for commercial applications.”
Goode has held board positions in seven companies and non-profit organizations. Prior to ViASIC, he was director of the Oak Ridge Design Center for Flextronics, and director of the FORGE Team, a high-end, customer-solutions-oriented ASIC task force. He co-founded ASIC International, Inc. (Ai) in 1993, and served as vice president of engineering before the company was sold to Flextronics in May 2001. An entrepreneur, Goode also has founded and assisted multiple successful companies and organizations. He holds a bachelor’s degree in music from University of Miami, a masters degree in computer science from New Jersey Institute of Technology, and a masters degree in business administration from the Wharton School at the University of Pennsylvania.
Speaking about his new roles, Goode said, “ViASIC is in a unique position to help leading-edge companies reduce non-recurring engineering and development costs by up to 95 percent, and significantly improve their time to market. I am honored to be part of the team that made this possible. ViASIC is committed to serving its customers worldwide, and I look forward to leading this effort.”
About ViASIC
ViASIC Inc. is the leading supplier of electronic design automation (EDA) tools, IP and services for reconfigurable semiconductor fabrics, both with and without SRAM. Reconfiguring far fewer metal layers than alternative approaches, ViASIC slashes design cost, time and risk. It enables ASSP providers, product designers, test chip designers, and other customers to reduce mask costs by up to 95% versus a standard ASIC design approach; it also speeds time to market by allowing manufacturing to begin before the design is fully completed, and by allowing silicon debug much earlier in the design flow. Founded in 2000, ViASIC is headquartered in Durham N.C. For more information about ViASIC and its products and services, visit www.viasic.com.
Related Semiconductor IP
- Simulation VIP for Ethernet UEC
- CAN-FD Controller
- Bluetooth® Low Energy 6.2 PHY IP with Channel Sounding
- Simulation VIP for UALink
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
Related News
- Veteran High-Tech Financial Officer Thomas J. Reid Joins Lexra As Chief Financial Officer
- Agere Systems Reaches 25 Million Mark in total SOC Shipments for Data Storage Applications
- ViASIC Introduces Industry’s First Practical One-Mask Chip Architecture and Companion Physical Design Software
- DCT Announces Highest-Performance Java Solution for Wireless Devices - Bigfoot Java Acceleration Technology Surpasses 10 Caffeine Mark Barrier
Latest News
- Quintauris releases RT-Europa, the first RISC-V Real-Time Platform for Automotive
- PQShield's PQCryptoLib-Core v1.0.2 Achieves CAVP Certification for a broad set of classical and post-quantum algorithms
- M31 Debuts at ICCAD 2025, Empowering the Next Generation of AI Chips with High-Performance, Low-Power IP
- Perceptia Begins Port of pPLL03 to Samsung 14nm Process Technology
- Spectral Design and Test Inc. and BAE Systems Announce Collaboration in RHBD Memory IP Development