InterDigital Licenses 3G Modem Technology to Leading Asian Semiconductor Company
KING OF PRUSSIA, Pa. -- Feb. 28, 2008
-- InterDigital, Inc. announced it has licensed its 3G modem technology to a leading Asian fabless semiconductor company. InterDigital's SlimChip(TM) Mobile Broadband Modem IP, high-performance WCDMA/HSDPA/HSUPA baseband designs and protocol stack software, has been selected for integration in the company's dual mode chips. Under the licensing agreement, InterDigital will provide complete UMTS 3GPP Release 6 modem technology and customer support.
"Licensing our SlimChip 3G modem technology to a leading Asian semiconductor manufacturer accelerates our participation in the world's largest mobile market," commented Mark Lemmo, Executive Vice President, Business Development for InterDigital. "In addition to this new relationship, our SlimChip solutions generated a great amount of interest at the recent Mobile World Congress in Barcelona as a very attractive way to participate in the rapidly growing market for mobile broadband devices."
InterDigital's family of SlimChip(TM) solutions include, high performance baseband ICs, broadband modem IP, and complete reference platforms. SlimChip products feature advanced receiver technology with receive diversity, providing superior interference mitigation resulting in higher data speeds and better coverage. In pre-customer trials on live networks and in the lab, the SlimChip Reference Platform in an Express Card form factor has delivered true mobile broadband performance with data speeds of up to 7.2 Mbps in the downlink and 1.5 Mbps in the uplink. The SlimChip design supports speeds of up to 10 Mbps in the downlink and 5.7 Mbps in the uplink, respectively.
About InterDigital
InterDigital designs, develops and provides advanced wireless technologies and products that drive voice and data communications. InterDigital is a leading contributor to the global wireless standards and holds a strong portfolio of patented technologies which it licenses to manufacturers of 2G, 2.5G, 3G, and 802 products worldwide. Additionally, the company offers a family of SlimChip(TM) high performance mobile broadband modem solutions, consisting of Baseband ICs, Modem IP and Reference Platforms. InterDigital's differentiated technology and product solutions deliver time-to-market, performance and cost benefits.
For more information, visit: www.interdigital.com
Related Semiconductor IP
- JESD204D Transmitter and Receiver IP
- 100G UDP IP Stack
- Frequency Synthesizer
- Temperature Sensor IP
- LVDS Driver/Buffer
Related News
- CEVA Streamlines 5G New Radio Modem Design with PentaG2, the Industry's Most Comprehensive 5G Baseband Platform IP for Mobile Broadband and IoT
- Synopsys' Module Compiler Slashes Design Time and Boosts Performance of SiCOM's New Broadband Wireless Modem
- IPWireless, Flextronics develop 3.5 million-gate IC for 3G broadband
- Cadence spin-out, Commsonic has added a multi-mode, multi-rate QAM modem and 802.16 Channel Codec to its family of broadband communications IP
Latest News
- HPC customer engages Sondrel for high end chip design
- PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Cadence Unveils Arm-Based System Chiplet
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers