Memory & Libraries IP for TSMC
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Memory & Libraries IP
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955
Memory & Libraries IP
for TSMC
from 31 vendors
(1
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10)
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Bi-Directional LVDS with LVCMOS
- Compliant with TIA/EIA-644 LVDS standard, also meets sub-LVDS
- Receiver compatible with HSCL levels for differential clock/data input
- LVDS transmitter and receiver have independent power control
- LVDS transmitter has adjustable output current level
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3.3V general purpose I/O for 28nm CMOS
- Enable higher voltage operation, beyond the foundry IO levels
- Easily replace existing I/O cells
- Integrated scalable ESD protection
- Bias circuit can be shared with multiple I/Os
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Library of LVDS IOs cells for TSMC 65LP
- TSMC 65 LP
- 2.5V/1.2V IO/Core transistors
- Fully compliant with TIA/EIA-644-A-2001
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Library of LVDS IOs cells for TSMC 40LP
- TSMC 40 LP
- 2.5V/1.1V IO/Core transistors
- Fully compliant with TIA/EIA-644-A-2001
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eTCAM (Embedded Ternary Content Addressable Memory IP
- One cycle operation latency (without priority encoder)
- Valid Bit per entry to reduce power
- Valid Bit reset in one cycle support
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eTCAM (Embedded Ternary Content Addressable Memory IP
- One cycle operation latency (without priority encoder)
- Valid Bit per entry to reduce power
- Valid Bit reset in one cycle support
- Mask input option for bit-write and masked search key
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LVDS RX & TX IOs in multiple foundry technology
- LVDS TX
- LVDS RX
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1.0-3.3V GPIO With I2C Open Drain And 3.3V & 5V Analog Cells in 55nm
- 1.0V-3.3V | 3.3V IO operation
- Dual independent IO rails
- Output enable / disable (HiZ when disabled)
- Power-down control (HiZ upon VDD disable)
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Open-drain I2C and SMBUS, DDC, CEC & HPD IO offerings
- I2C Open-drain
- Physical Features
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Secure Digital I/O offerings
- Secure Digital
- Physical Features