Memory & Libraries IP for TSMC

This SLVS I/O Library, implemented in TSMC 22nm with an 11P7M_5X1Z UT-AlRDL metal stack, provides a 0.9V differential transceiver optimized for low-power, high-speed operation.
Supporting data rates up to 200 Mbps and compliant with JESD8-13 SLVS standards, the library features strong power supply rejection, integrated 100 on-die termination, and robust 2 kV HBM / 500 V CDM ESD protection.

This 1.8V SLVS transceiver is a high-performance, low-power I/O solution optimized for TSMCs 28nm process.
Designed with 1.8V thick oxide devices and a standard low-voltage core interface at 0.8V, this transceiver ensures robust operation across a wide temperature range (-40°C to 125°C).
Supporting high-speed differential signaling up to 2Gbps, it delivers ex- ceptional signal integrity with low jitter and precise eye diagrams.

The 1.2V Thin Gate GPIO is an IP macro for on-chip integration. It is a 1.2V general purpose I/O that does not rely on thick-gate devices. Only thin-gate, 0.9V capable core MOS devices are used in the design.
Supported features include core isolation, programmable slew rate compensation, programmable drive strength, input/output enable, pull select and pull enable. Extra features such as programmable hysteresis can be supported upon request.

The 3.3V capable GPIO is an IP macro for on-chip integration. It is a 3.3V general purpose I/O built with a stack of 1.8V thick oxide MOS devices. It is controlled by 0.9V (core) signals.
Supported features include core isolation, output enable and pull enable. Extra features such as input enable/disable, programmable drive strength and pull select, can be supported upon request.

The 1.8V capable GPIO is an IP macro for on-chip integration. It is a 1.8V general purpose I/O built with a stack of 1.2V MOS FINFET devices. It is controlled by 0.75V (core) signals.
Supported features include core isolation, output enable and pull enable. Extra features such as input enable/disable, programmable drive strength and pull select, can be supported upon request.

A 1.8V/3.3V flip-chip I/O library with ESD-immune GPIOs and integrated POC circuitry in TSMC FFC/FFC+.
This library is a production-ready I/O library built on the TSMC 12nm process. The library features 1.8V to 3.3V GPIOs with programmable drive strength, hysteresis, and control logic.

The MXL-DS-LVDS is a high performance 4-channel LVDS Deserializer implemented using digital CMOS technology.
Both the serial and parallel data are organized into four channels. The parallel data can be 7 or 10 bits wide per channel. The input clock is 25MHz to 165MHz. The De-serializer is highly integrated and requires no external components.

The MXL-SR-LVDS is a high performance 4-channel LVDS Serializer implemented using digital CMOS technology. Both the serial and parallel data are organized into four channels.
The parallel data width is programmable, and the input clock is 25MHz to 165MHz. The Serializer is highly integrated and requires no external components.

The MXL-LVDS-MIPI-RX is a high-frequency, low-power, low-cost, source-synchronous, Physical Layer that supports the MIPI^® Alliance Standard for D-PHY and compatible with the TIA/EIA-644 LVDS standard.
The IP is configured as a MIPI slave and consists of 5 lanes: 1 Clock lane and 4 data lanes, which make it suitable for display serial interface applications (DSI).

The MXL-LVDS-DPHY-DSI-TX is a combo PHY that consists of a high-frequency low-power, low-cost, source-synchronous, Physical Layer supporting the MIPI^® Alliance Standard for D-PHY and a high performance 4-channel LVDS Serializer implemented using digital CMOS technology.
In LVDS mode, both the serial and parallel data are organized into 4 channels. The parallel data is 7 bits wide per channel. The input clock is 25MHz to 150MHz. The serializer is highly integrated and requires no external components. The circuit is designed in a modular fashion and desensitized to process variations. This facilitates process migration, and results in a robust design.