TSMC Wafer Allocation and Design Migration
In the name of blogging and increased transparency lets talk about wafer allocation, because it’s coming, believe it. There is already a significant delta between wafer demand and manufacture due to record low inventory levels and the exploding semiconductor demand in China. Both TSMC and UMC posted good July sales numbers: TSMC realized a 17.9% jump from June, UMC a 6.97% jump. In difficult economic times the strong get stronger, as TSMC definitely has, as the 2009 market share data will definitely show.
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related Blogs
- TSMC OIP: What to Do With 20,000 Wafers Per Day
- Fab allocation back on the agenda
- What's happening on the 450mm wafer front?
- Intel Q2 Financial Secret: "Shhhh...We're on Allocation"
Latest Blogs
- Cadence Announces Industry's First Verification IP for Embedded USB2v2 (eUSB2v2)
- The Industry’s First USB4 Device IP Certification Will Speed Innovation and Edge AI Enablement
- Understanding Extended Metadata in CXL 3.1: What It Means for Your Systems
- 2025 Outlook with Mahesh Tirupattur of Analog Bits
- eUSB2 Version 2 with 4.8Gbps and the Use Cases: A Comprehensive Overview