What's happening on the 450mm wafer front?
Speaking at the International Electronic s Forum 2010 early this month, TSMC’s CTO, Jack Sun, said that he believed a move to 450mm wafers is important for cost reduction and that is going to happen; he reckons middle of this decade.
The three biggest capex spenders -TSMC, Samsung and Intel want 450mm. But none have contributed substantial funding – an estimated $25bn - $30bn R&D investment by suppliers. 300mm was funded by the equipment suppliers. The same may not be expected this time as the fact whether the suppliers have recouped their investments is still uncertain. Plus they have their other expensive baggage – transition to new process nodes, TSVs, materials etc.
To read the full article, click here
Related Semiconductor IP
- xSPI Multiple Bus Memory Controller
- MIPI CSI-2 IP
- PCIe Gen 7 Verification IP
- WIFI 2.4G/5G Low Power Wakeup Radio IP
- Radar IP
Related Blogs
- How Much Cost Reduction Will 450mm Wafers Provide
- Why do we need 450mm wafers?
- The State of 450mm Wafers. And Intel Gossip
- TSMC Wafer Allocation and Design Migration
Latest Blogs
- The Growing Importance of PVT Monitoring for Silicon Lifecycle Management
- Unlock early software development for custom RISC-V designs with faster simulation
- HBM4 Boosts Memory Performance for AI Training
- Using AI to Accelerate Chip Design: Dynamic, Adaptive Flows
- Locking When Emulating Xtensa LX Multi-Core on a Xilinx FPGA