What's happening on the 450mm wafer front?
May 10, 2010
Speaking at the International Electronic s Forum 2010 early this month, TSMC’s CTO, Jack Sun, said that he believed a move to 450mm wafers is important for cost reduction and that is going to happen; he reckons middle of this decade.
The three biggest capex spenders -TSMC, Samsung and Intel want 450mm. But none have contributed substantial funding – an estimated $25bn - $30bn R&D investment by suppliers. 300mm was funded by the equipment suppliers. The same may not be expected this time as the fact whether the suppliers have recouped their investments is still uncertain. Plus they have their other expensive baggage – transition to new process nodes, TSVs, materials etc.
To read the full article, click here
Related Semiconductor IP
- NPU IP Core for Mobile
- NPU IP Core for Edge
- Specialized Video Processing NPU IP
- HYPERBUS™ Memory Controller
- AV1 Video Encoder IP
Related Blogs
- How Much Cost Reduction Will 450mm Wafers Provide
- Why do we need 450mm wafers?
- The State of 450mm Wafers. And Intel Gossip
- TSMC Wafer Allocation and Design Migration
Latest Blogs
- Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
- The Role of GPU in AI: Tech Impact & Imagination Technologies
- Time-of-Flight Decoding with Tensilica Vision DSPs - AI's Role in ToF Decoding
- Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles
- Deep Robotics and Arm Power the Future of Autonomous Mobility