What's happening on the 450mm wafer front?
May 10, 2010
Speaking at the International Electronic s Forum 2010 early this month, TSMC’s CTO, Jack Sun, said that he believed a move to 450mm wafers is important for cost reduction and that is going to happen; he reckons middle of this decade.
The three biggest capex spenders -TSMC, Samsung and Intel want 450mm. But none have contributed substantial funding – an estimated $25bn - $30bn R&D investment by suppliers. 300mm was funded by the equipment suppliers. The same may not be expected this time as the fact whether the suppliers have recouped their investments is still uncertain. Plus they have their other expensive baggage – transition to new process nodes, TSVs, materials etc.
Related Semiconductor IP
- AES GCM IP Core
- High Speed Ethernet Quad 10G to 100G PCS
- High Speed Ethernet Gen-2 Quad 100G PCS IP
- High Speed Ethernet 4/2/1-Lane 100G PCS
- High Speed Ethernet 2/4/8-Lane 200G/400G PCS
Related Blogs
- How Much Cost Reduction Will 450mm Wafers Provide
- Why do we need 450mm wafers?
- The State of 450mm Wafers. And Intel Gossip
- TSMC Wafer Allocation and Design Migration
Latest Blogs
- Why Choose Hard IP for Embedded FPGA in Aerospace and Defense Applications
- Migrating the CPU IP Development from MIPS to RISC-V Instruction Set Architecture
- Quintauris: Accelerating RISC-V Innovation for next-gen Hardware
- Say Goodbye to Limits and Hello to Freedom of Scalability in the MIPS P8700
- Why is Hard IP a Better Solution for Embedded FPGA (eFPGA) Technology?