What's happening on the 450mm wafer front?
May 10, 2010
Speaking at the International Electronic s Forum 2010 early this month, TSMC’s CTO, Jack Sun, said that he believed a move to 450mm wafers is important for cost reduction and that is going to happen; he reckons middle of this decade.
The three biggest capex spenders -TSMC, Samsung and Intel want 450mm. But none have contributed substantial funding – an estimated $25bn - $30bn R&D investment by suppliers. 300mm was funded by the equipment suppliers. The same may not be expected this time as the fact whether the suppliers have recouped their investments is still uncertain. Plus they have their other expensive baggage – transition to new process nodes, TSVs, materials etc.
To read the full article, click here
Related Semiconductor IP
- JESD204E Controller IP
- eUSB2V2.0 Controller + PHY IP
- I/O Library with LVDS in SkyWater 90nm
- 50G PON LDPC Encoder/Decoder
- UALink Controller
Related Blogs
- How Much Cost Reduction Will 450mm Wafers Provide
- Why do we need 450mm wafers?
- The State of 450mm Wafers. And Intel Gossip
- TSMC Wafer Allocation and Design Migration
Latest Blogs
- A Low-Leakage Digital Foundation for SkyWater 90nm SoCs: Introducing Certus’ Standard Cell Library
- FPGAs vs. eFPGAs: Understanding the Key Differences
- UCIe D2D Adapter Explained: Architecture, Flit Mapping, Reliability, and Protocol Multiplexing
- RT-Europa: The Foundation for RISC-V Automotive Real-Time Computing
- Arm Flexible Access broadens its scope to help more companies build silicon faster