TSMC OIP: What to Do With 20,000 Wafers Per Day
Today it is TSMC's OIP Ecosystem Innovation forum. This is an annual event but is also a semi-annual update on TSMC's processes, investment, volume ramps and more. TSMC have changed the rules for the conference this year: they have published all the presentations by their partners/customers. Tom Quan of TSMC told me that they will also provide a subset of the presentations TSMC gave to open the day.
The semiconductor business is driven by several large markets, the biggest of which is mobile. Fun statistics of the day are that mobile grew 26% from 2014-15 to shipments of 1.9B units. Since there are 4.3B worldwide mobile users, this means that the annual replacement rate is close to 50%. Global mobile traffic is forecast to go up 10X in 5 years from 30EB/yr in 2014 to 292EB/yr in 2019 (EB is exabyte).
To read the full article, click here
Related Semiconductor IP
- TSMC CLN3FFP HBM4 PHY
- Wi-Fi 7(be) RF Transceiver IP in TSMC 22nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- HBM3 PHY V2 (Hard) - TSMC N3P
- USB4 Gen3 x2-lane PHY, TSMC N5, 1.2V, N/S orientation, type-C
Related Blogs
- TSMC OIP and the Insatiable Computing Trend!
- TSMC OIP: Process Status
- Analog Bits Builds a Road to the Future at TSMC OIP
- TSMC OIP vs CDNS OIP Analysis
Latest Blogs
- lowRISC Tackles Post-Quantum Cryptography Challenges through Research Collaborations
- How to Solve the Size, Weight, Power and Cooling Challenge in Radar & Radio Frequency Modulation Classification
- Programmable Hardware Delivers 10,000X Improvement in Verification Speed over Software for Forward Error Correction
- The Integrated Design Challenge: Developing Chip, Software, and System in Unison
- Introducing Mi-V RV32 v4.0 Soft Processor: Enhanced RISC-V Power