Semicon West: The Roadmap is 3D IC
Semicon West: all roads lead to 3D IC, and 'More than Moore.'
This year Semicon West had a clear undertone — the roadmap forward is 3D IC. Yes, we can and we will keep pushing dimensions down, which for a few applications would be attractive, but for most designs the path forward would be “More than Moore.” As Globalfoundries' CEO Jha recently voiced: “it's clear that More-than-Moore is now mainstream rather than niche. …Really it is leading-edge pure digital that is the niche. Instead the high-cost leading edge processes are really niche processes optimized for applications in data centers or for high computational loads, albeit niches with volumes of hundred of millions of units per year.” Similarly, EE Times editor Rick Merritt subtitled his Semicon West summary Roadmap being drawn for chip stacks.
Related Semiconductor IP
- 1-port Receiver or Transmitter HDCP 2.3 on HDMI 2.1 ESM
- HDMI 2.0/MHL RX Combo 1P PHY 6Gbps in TSMC 28nm HPC 1.8V, North/South Poly Orientation
- HDMI 2.0 RX PHY in SS 8LPP 1.8V, North/South Poly Orientation
- HDMI 2.0 RX Controller with HDCP
- HDMI 2.0 RX 4P PHY 6Gbps in TSMC 28nm HPM 1.8V, North/South Poly Orientation
Related Blogs
- Want a peek at a possible Qualcomm 3D IC roadmap?
- What's driving 3D IC design? Do 2D EDA tools need a total overhaul to support 3D design?
- Interchip Connectivity: C2C, MIPI LLI and the path to 3D IC and TSV
- Intel Calls for 3D IC
Latest Blogs
- Scaling Out Deep Learning (DL) Inference and Training: Addressing Bottlenecks with Storage, Networking with RISC-V CPUs
- Cadence Transforms Chiplet Technology with First Arm-Based System Chiplet
- Redefining XPU Memory for AI Data Centers Through Custom HBM4 – Part 2
- Redefining XPU Memory for AI Data Centers Through Custom HBM4 – Part 1
- Why Choose Hard IP for Embedded FPGA in Aerospace and Defense Applications