Semicon West: The Roadmap is 3D IC
Semicon West: all roads lead to 3D IC, and 'More than Moore.'
This year Semicon West had a clear undertone — the roadmap forward is 3D IC. Yes, we can and we will keep pushing dimensions down, which for a few applications would be attractive, but for most designs the path forward would be “More than Moore.” As Globalfoundries' CEO Jha recently voiced: “it's clear that More-than-Moore is now mainstream rather than niche. …Really it is leading-edge pure digital that is the niche. Instead the high-cost leading edge processes are really niche processes optimized for applications in data centers or for high computational loads, albeit niches with volumes of hundred of millions of units per year.” Similarly, EE Times editor Rick Merritt subtitled his Semicon West summary Roadmap being drawn for chip stacks.
To read the full article, click here
Related Semiconductor IP
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- FH-OFDM Modem
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- PQC CRYSTALS core for accelerating NIST FIPS 202 FIPS 203 and FIPS 204
- USB Full Speed Transceiver
Related Blogs
- Want a peek at a possible Qualcomm 3D IC roadmap?
- What's driving 3D IC design? Do 2D EDA tools need a total overhaul to support 3D design?
- Intel Calls for 3D IC
- SEMICON West - Globalfoundries Update