Can You Save 15% of you ASIC Package Cost Today? Hint: Wirebonds
In today’s competitive semiconductor space everybody is eager to reduce their ASIC production cost. Some say that dramatic redesign changes would lead to significant reduction in chip cost, for instance – using a more advanced silicon technology node to shrink the die size. But this is really a big and painful step.
In this post I will describe a very simple method which will enable you to cut 5% to 15% of your assembly cost.
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- Bluetooth Low Energy 6.0 Digital IP
- MIPI SWI3S Manager Core IP
- Ultra-low power high dynamic range image sensor
- Neural Video Processor IP
Related Blogs
- 5 Easy Steps to Calculate ASIC Unit Cost
- Want 10nm Wafers? That'll Cost You
- Why You Need to Consider Energy Efficiency of Your HPC SoC Early On
- Want to Mix and Match Dies in a Single Package? UCIe Can Get You There
Latest Blogs
- Breaking the Silence: What Is SoundWire‑I3S and Why It Matters
- What It Will Take to Build a Resilient Automotive Compute Ecosystem
- The Blind Spot of Semiconductor IP Sales
- Scalable I/O Virtualization: A Deep Dive into PCIe’s Next Gen Virtualization
- UEC-LLR: The Future of Loss Recovery in Ethernet for AI and HPC