Can You Save 15% of you ASIC Package Cost Today? Hint: Wirebonds
In today’s competitive semiconductor space everybody is eager to reduce their ASIC production cost. Some say that dramatic redesign changes would lead to significant reduction in chip cost, for instance – using a more advanced silicon technology node to shrink the die size. But this is really a big and painful step.
In this post I will describe a very simple method which will enable you to cut 5% to 15% of your assembly cost.
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related Blogs
- 5 Easy Steps to Calculate ASIC Unit Cost
- Want 10nm Wafers? That'll Cost You
- Want to Mix and Match Dies in a Single Package? UCIe Can Get You There
- Design specification: The cornerstone of an ASIC collaboration
Latest Blogs
- A Bench-to-In-Field Telemetry Platform for Datacenter Power Management
- IDS-Verify™: From Specification to Sign-Off – Automated CSR, Hardware Software Interface and CPU-Peripheral Interface Verification
- RISC-V and GPU Synergy in Practice: A Path Towards High-Performance SoCs from SpacemiT K3
- EDA AI Agents: Intelligent Automation in Semiconductor & PCB Design
- Why Security Can't Exist Without Trust