Moore's Law seen hitting big bump at 14 nm
A recent EE Times article covering IMEC's Luc van den Hove keynote talk at IEDM 2012 reports: "Chips made at the 14-nm process node may deliver as little as half the typical 30 percent performance increase – and still carry a hefty cost premium – due to the lack of next-generation lithography." Van den Hove provided the following slide photo as an illustration:
Yet, in another EE Times article about Intel’s 22nm IEDM presentation, EE Times quotes Mark Bohr of Intel as saying: "Projections from an IMEC keynote that 14-nm wafers will be 90 percent more expensive than 28-nm parts due to the lack of EUV lithography are inaccurate," The article also quotes Bohr as saying "The increase for 14-nm wafers at Intel is nowhere near that. Cost per wafer has always gone up marginally each generation, somewhat more so in recent generations, but that’s more than offset by increases in transistor density so that the cost per transistor continues to go down at 14nm."
So who is right between those two giants?
Could it be that both of them are?
To read the full article, click here
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related Blogs
- 28 nm - The Last Node of Moore's Law
- Moore's Law good for 14nm, and probably, 10nm: Dr. Wally Rhines
- Moore’s Law and 40nm Yield
- Moore's Law and 28nm Yield
Latest Blogs
- Cadence Announces Industry's First Verification IP for Embedded USB2v2 (eUSB2v2)
- The Industry’s First USB4 Device IP Certification Will Speed Innovation and Edge AI Enablement
- Understanding Extended Metadata in CXL 3.1: What It Means for Your Systems
- 2025 Outlook with Mahesh Tirupattur of Analog Bits
- eUSB2 Version 2 with 4.8Gbps and the Use Cases: A Comprehensive Overview