How to Achieve High Bandwidth and Low Latency Die-to-Die Connectivity
High-performance computing (HPC) is a hot topic these days, and for good reason. Consider the can containing your favorite soda – countless hours of simulation and engineering work using HPC systems have gone into designing streamlined cans that minimize aluminum waste. Indeed, the benefits of HPC are far-reaching, from its use in mining cryptocurrencies to drug testing, genome sequencing, creating lighter planes, researching space, running artificial intelligence (AI) workloads, and modeling climate change.
Processing massive amounts of data is driving demands for larger and more complex chips at advanced process nodes. What’s more, hyperscalers are transforming the way that data centers are designed and how computing resources are organized. To support their business imperatives of delivering ready access to multimedia resources, fast e-commerce transactions, quick search engine results, and the like, these companies are innovating with new data center architectures—namely, chiplets or multi-die SoC architectures.
In this blog post, I’ll discuss how splitting SoCs into smaller dies for advanced packaging and using die-to-die interfaces to enable high bandwidth, low latency, and low power connectivity can benefit hyperscale data centers. Additionally, I’ll also cover what’s needed to optimize these applications.
To read the full article, click here
Related Semiconductor IP
- TSMC CLN5FF GUCIe LP Die-to-Die PHY
- UCIe Die-to-Die Chiplet Controller
- TSMC CLN6FF/7FF Die-to-Die Interface PHY
- Die-to-Die PHY
- Chiplet Interconnect - Die-to-die interconnect IP solutions for advanced and standard packaging applications
Related Blogs
- How to Solve the Size, Weight, Power and Cooling Challenge in Radar & Radio Frequency Modulation Classification
- High Bandwidth Memory Evolution from First Generation HBM to the Latest HBM4
- How to Achieve Faster Signoff of Billion-Gate, Low-Power SoCs
- How the CXL Standard Improves Latency in High-Performance Computing
Latest Blogs
- UWB, Digital Keys, and the Quest for Greater Range
- Building Smarter, Faster: How Arm Compute Subsystems Accelerate the Future of Chip Design
- MIPS P8700 RISC-V Processor for Advanced Functional Safety Systems
- Boost SoC Flexibility: 4 Design Tips for Memory Subsystems with Combo DDR3/4 Interfaces
- High Bandwidth Memory Evolution from First Generation HBM to the Latest HBM4