Die-to-Die IP
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85
IP
from 16 vendors
(1
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10)
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UCIe Die-to-Die Chiplet Controller
- High configurability and customizability
- Defines packets to communicate with a link partner using different AXI parameters
- Supports raw streaming modes
- Provides various Flit formats in UCIe v1.1 (filt format 2: 68B flit format, flit format 3/4: standard 256B flit format, and flit format 5/6: latency optimized 256B flit format)
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Die-to-Die, High Bandwidth Interconnect PHY Ported to TSMC N7 X24
- Delivers up to 4Gbps per pin with up to bidirectional 2 Tbps/mm of die edge
- High-bandwidth, low-power, low-latency multi-channel PHY in applications requiring connections between dies within a package
- Compliant with Intel Advanced Interface Bus (AIB) v1.1 standard
- Compliant with IEEE 1149.1 (JTAG), 1149.6 (AC JTAG) for easy integration with SoC testability framework
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Die-to-Die, High Bandwidth Interconnect PHY Ported to TSMC N5 X24, North/South (vertical) poly orientation
- Delivers up to 4Gbps per pin with up to bidirectional 2 Tbps/mm of die edge
- High-bandwidth, low-power, low-latency multi-channel PHY in applications requiring connections between dies within a package
- Compliant with Intel Advanced Interface Bus (AIB) v1.1 standard
- Compliant with IEEE 1149.1 (JTAG), 1149.6 (AC JTAG) for easy integration with SoC testability framework
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Die-to-Die, AIB 2.0 PHY Ported to Intel 16, North/South (vertical) poly orientation
- Delivers up to 4Gbps per pin with up to bidirectional 2 Tbps/mm of die edge
- High-bandwidth, low-power, low-latency multi-channel PHY in applications requiring connections between dies within a package
- Compliant with Intel Advanced Interface Bus (AIB) v1.1 standard
- Compliant with IEEE 1149.1 (JTAG), 1149.6 (AC JTAG) for easy integration with SoC testability framework
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Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N7 X16, North/South (vertical) poly orientation
- 16-lane TX and RX square macros for placement in any edge of the die
- Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
- Implements NRZ and PAM-4 signaling
- Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
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Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N6 X16, North/South (vertical) poly orientation
- 16-lane TX and RX square macros for placement in any edge of the die
- Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
- Implements NRZ and PAM-4 signaling
- Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
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Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N5 X16, North/South (vertical) poly orientation
- 16-lane TX and RX square macros for placement in any edge of the die
- Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
- Implements NRZ and PAM-4 signaling
- Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
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Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC 12FFC X8, North/South (vertical) poly orientation
- 16-lane TX and RX square macros for placement in any edge of the die
- Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
- Implements NRZ and PAM-4 signaling
- Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
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Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC 12FFC X16, North/South (vertical) poly orientation
- 16-lane TX and RX square macros for placement in any edge of the die
- Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
- Implements NRZ and PAM-4 signaling
- Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
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Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to GF 12LP+ x8, North/South (vertical) poly orientation
- 16-lane TX and RX square macros for placement in any edge of the die
- Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
- Implements NRZ and PAM-4 signaling
- Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
