Minimize Design Risk and Achieve First-Pass Silicon Success on TSMC's N3E Process
Although the path from chip design to tape-out was never an easy one to navigate, this journey has become ever more challenging due to a growing demand for lower-power, higher-bandwidth applications. Indeed, chip architectures continue to increase in complexity on the most advanced FinFET nodes as billions of transistors are packed into smaller, denser silicon packages to meet new power, performance, and area (PPA) requirements. That’s why Synopsys and TSMC continuously collaborate to deliver the chip design industry’s broadest silicon-proven IP portfolio on the latest process technologies.
Synopsys’ IP silicon success for the TSMC N3E node—which provides a fast path to TSMC N3P, N3AE, and beyond—minimizes integration risks and accelerates time to market. Read on to learn how Synopsys IP enables semiconductor companies to develop advanced SoCs and multi-die systems for a wide range applications and technologies including artificial intelligence (AI) and machine learning (ML), high-performance computing (HPC), and mobile.
To read the full article, click here
Related Semiconductor IP
- SoC Security Platform / Hardware Root of Trust
- SPI to AHB-Lite Bridge
- Octal SPI Master/Slave Controller
- I2C and SPI Master/Slave Controller
- AHB/AXI4-Lite to AXI4-Stream Bridge
Related Blogs
- Synopsys Accelerates Multi-Die System Designs With Successful UCIe PHY IP Tape-Out on TSMC N3E Process
- Synopsys Tapes Out SLM PVT Monitor IP on TSMC N5 and N3E Processes
- TSMC OIP: On the Road to the Silicon Super Chip
- TSMC at the 2015 Imagination Summit: optimized silicon IP for the IoT market