Cadence Recognized as TSMC OIP Partner of the Year at 2025 OIP Ecosystem Forum

By Cadence

October 9, 2025

The semiconductor industry thrives on collaboration, and few pairings exemplify this better than the longstanding relationship between Cadence and Taiwan Semiconductor Manufacturing Company (TSMC). At the 2025 TSMC Open Innovation Platform^® (OIP) Ecosystem Forum, Cadence was honored as OIP Partner of the Year across multiple categories. These prestigious awards underscore Cadence's commitment to delivering innovative solutions that empower customers to shorten their time to working silicon in an increasingly complex design landscape.

TSMC recognizes Cadence's contributions to advancing technologies that enable high-performance, energy-efficient semiconductor innovations. Whether it's pioneering AI-assisted design or facilitating RF design migration, Cadence has consistently proven its ability to meet the challenges of modern chip design with transformative methodologies and tools.

Key Awards and Recognitions

Cadence's achievements are reflective of a deep understanding of TSMC's technology roadmap and an unwavering focus on customer success. The key categories in which Cadence received recognition are:

• Joint Development of A14 and A16^™ Design Infrastructure
  Cadence was recognized for its groundbreaking contributions to design creation and verification solutions optimized for TSMC's advanced technologies. These innovations enable customers to efficiently design and verify products at leading-edge nodes while maintaining unmatched performance, power, and area (PPA) targets.
• Joint Development of COUPE Multi-Wavelength Design Solutions
  Acknowledged for delivering methodologies that address challenges like multi-wavelength integration and thermal considerations, Cadence has played a pivotal role in bringing the electrical and optical domains closer together for design on TSMC-COUPE^™ technology.
• Joint Collaboration on AI-Assisted Design Solutions
  Cadence was honored for enhancing engineering productivity, PPA, and overall design quality with AI-driven automation in various design flows. These solutions mark a significant leap forward in productivity gains for semiconductor innovations.
• Joint Development of RF Design Migration Solutions
  Cadence was awarded for extending RF design migration solutions to more process technologies, now encompassing TSMC N16 mmWave, N6RF, and N4PRF. These solutions ensure more flexible technology adoption.
• DSP IP
  By providing an extensive portfolio of design and verification IP, Cadence has made a significant impact, facilitating faster design cycles and robust compute capabilities for customer products.

Explore Cadence's AI-Driven Chip Design Solutions

With this recognition from TSMC, Cadence reaffirms its dedication to helping customers succeed in a rapidly evolving semiconductor landscape. If you're looking to accelerate your next-generation designs or adopt cutting-edge technologies, connect with Cadence experts today.

Read about TSMC's EDA tool certification and Cadence status.

Contact Cadence or learn more about how our innovative solutions can transform your design process and take your products to the next level.