Shaping the Future of Semiconductor Design Through Collaboration: Synopsys Wins Multiple TSMC OIP Partner of the Year Awards

By Arun Bhattacharya

October 2, 2025

Synopsys has once again been recognized as a key collaboration partner by TSMC. We received six Partner of the Year awards at the 2025 TSMC Open Innovation Platform® (OIP) Ecosystem Forum. These honors — spanning AI-assisted design solutions, EDA flows, RF design migration, multi-die design testing, interface IP, and silicon photonics — underscore the pivotal role of our partnership in shaping the future of semiconductor design.

Award-winning collaboration enabling high-performance, energy-efficient design

Driven by the demands of AI, ever-smaller process nodes, and the shift to modular, multi-die designs, the semiconductor industry is undergoing rapid transformation. Our enduring collaboration with TSMC sits at the heart of these trends, delivering the tools and IP that empower engineers to meet next-generation challenges head-on.

In recognition of our impact in these critical areas, we received TSMC OIP Partner of the Year awards in the following categories:

EDA flows for TSMC A16™ and A14

• Award: Joint Development of A14 and A16™ Design Infrastructure
• Industry impact: We have developed innovative tools and methodologies for TSMC’s Super Power Rail (SPR), enabling customers to leverage their A16™ node for substantial gains in logic density and performance. In addition, we’re collaborating with TSMC on the design flow for their A14 process, with the first process design kit scheduled for release by the end of 2025.

AI-assisted design solutions

• Award: Joint Collaboration on AI-assisted Design Solutions
• Industry impact: By harnessing AI to optimize power, performance, and area (PPA) on TSMC’s most advanced nodes, our AI-assisted EDA solutions enable design teams to accelerate development cycles, reduce manual effort, and improve efficiency in complex semiconductor designs. This empowers customers to push the limits of innovation and deliver differentiated products faster in dynamic markets like AI, cloud, and high-performance computing (HPC).

Silicon photonics

• Award: Joint Development of COUPE Multi-wavelength Design Solutions
• Industry impact: As high-speed, energy-efficient data transfer becomes increasingly critical for AI and cloud applications, photonics is emerging as a key enabler. Our AI-optimized photonic solutions, developed with TSMC for their COUPE platform, enable designers to address complex multi-wavelength and thermal requirements — driving innovation in optical interconnects and advanced computing.

RF design migration

• Award: Joint Development of RF Design Migration Solutions
• Industry impact: The rapid evolution of wireless and communications technology demands seamless migration to leading-edge nodes. Synopsys ASO.ai, recognized for its AI-assisted, layout-aware optimization, extends RF design migration from TSMC’s N16 mmWave and N6RF nodes to the newer N4PRF node — helping engineers meet the demands of next-generation connectivity.

Ensuring 3D multi-die testability

• Award: 3DFabric Testing
• Industry impact: With our UCIe, test, and SLM IP solutions optimized for TSMC’s N3P process and CoWoS® interposer technology, customers can streamline test processes across the multi-die chip lifecycle — from wafer sorting and package testing to System Level Test (SLT) and In-System Monitoring and Test.

Interface IP

• Award: IP – Interface IP
• Industry impact: Our silicon-proven Interface IP portfolio — optimized for low power, high performance, compact area, and low latency across TSMC nodes — enables chip designers to accelerate time to market for automotive, consumer, AI, and HPC applications. 

Why these awards matter

These Partner of the Year awards are more than recognition — they highlight the key areas of focus for the OIP ecosystem and how we are working with TSMC to address customers' design challenges.

• Alignment with industry mega-trends: Each award reflects our commitment to the most important trends in the semiconductor industry, including AI-assisted productivity, advanced node scaling, multi-die integration, and next-generation connectivity.
• Customer-centric innovation: By co-developing solutions with TSMC, we ensure our tools, IP, and design flows are rigorously validated. This enables customers to reduce risk, accelerate design cycles, and achieve higher performance.
• Accelerating time-to-market: Our award-winning solutions streamline complex design and integration processes, empowering engineering teams to deliver products faster.

Driving the future together

The multiple Partner of the Year awards from TSMC reaffirm our ongoing commitment to semiconductor innovation. In today’s era of pervasive intelligence, our collaboration with TSMC continues to exemplify what’s possible — delivering the technology, tools, and IP that enable customers to turn big ideas into breakthrough products.

We are honored to be recognized by TSMC and look forward to shaping the future of the semiconductor industry together.

White paper: Multi-Die Design Start Guide