Breakthrough in area efficiency of on-chip ESD protection
ESD protection in the most advanced FinFET technology is challenging: The ESD design window (link) is extremely narrow in FinFET processes (link). Moreover, some of the conventional ESD solutions like the ggNMOS based protection are not effective anymore (link).
To protect sensitive FinFET circuits IC designers need to design the traditional ESD clamps and diodes a lot bigger. It is also required to reduce the distance between rail clamps and interface pads. It leads to an increase in ESD related area and increase in parasitic capacitance at the interfaces from scaling up the ESD (dual) diodes.
To read the full article, click here
Related Blogs
- Optimized on-chip ESD protection to enable high-speed Ethernet speed in cars
- Selecting optimized ESD protection for CMOS image sensors
- Security for SoC Interfaces Takes Center Stage in Data Protection
- Dynamic Vector Threading for High Efficiency in Fixed Wireless Access, vRAN & Massive MIMO Beamforming
Latest Blogs
- FiRa 3.0 Use Cases: Expanding the Future of UWB Technology
- Cadence Announces Industry's First Verification IP for Embedded USB2v2 (eUSB2v2)
- The Industry’s First USB4 Device IP Certification Will Speed Innovation and Edge AI Enablement
- Understanding Extended Metadata in CXL 3.1: What It Means for Your Systems
- 2025 Outlook with Mahesh Tirupattur of Analog Bits