Arteris FlexNoC互连IP经Nextchip汽车高级驾驶辅助系统(ADAS)授权
Complete interconnect IP solution accelerates image processing system-on-chip (SoC) development
CAMPBELL, Calif. – February 7, 2017 – Arteris Inc., the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced that Nextchip has licensed Arteris FlexNoC interconnect IP for use in image-based automotive ADAS systems.
“We found that Arteris FlexNoC was by far the most complete interconnect IP offering available today,” said Hweihn Chung, CTO and VP of Automotive BU at Nextchip. “FlexNoC’s quality-of-service, simulation and integration features are eons ahead of all other commercial interconnect solutions. We are confident we will be able to create better performing systems in less time due to our adoption of Arteris FlexNoC IP.”
“Arteris is thrilled to be part of Nextchip’s next-generation ADAS systems,” said K. Charles Janac, President and CEO of Arteris. “Nextchip’s decision is one more proof point of Arteris technology’s importance in enabling automotive ADAS and autonomous driving systems.”
About Arteris
Arteris, Inc. provides system-on-chip (SoC) interconnect IP and tools to accelerate SoC semiconductor assembly for a wide range of applications. Rapid semiconductor designer adoption by customers such as Samsung, Huawei / HiSilicon, Mobileye, Altera (Intel), and Texas Instruments has resulted in Arteris being the only semiconductor IP company to be ranked in the Inc. 500 and Deloitte Technology Fast 500 lists in 2012 and 2013. Customer results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. More information can be found at www.arteris.com.
Related Semiconductor IP
- Die-to-Die, High Bandwidth Interconnect PHY Ported to TSMC N7 X24
- Die-to-Die, High Bandwidth Interconnect PHY Ported to TSMC N5 X24, North/South (vertical) poly orientation
- Crossbars Interconnect
- Die-to-Die, High Bandwidth Interconnect PHY in TSMC (N7, N5)
- Network-on-Chip (NoC) Interconnect IP
Related News
- Black Sesame 再次选用Arteris IP 的FlexNoC Interconnect与Resilience Package方案,针对其满足 ISO 26262 标准的汽车 ADAS 芯片
- 瑞萨电子(欧洲)选择Arteris FlexNoC物理互联IP用于高端工业和通信片上系统设计
- 中兴获得Arteris FlexNoC授权使用其互联IP 用于片上系统(SoC)设计
- Arteris的FlexNoC IP 和 FlexNoC Resilience开发包授权东芝用于先进驾驶辅助系统