Bridging the gap between custom ASICs and ARM-based MCUs
Mark Saunders, Senior Product Marketing Manager, Cypress Semiconductor
EETimes (10/4/2010 5:53 PM EDT)
One perspective for thinking of the embedded world is as a spectrum of complexity ranging from ASIC to MCU. ASIC designs are enormously expensive and take years to complete but the potential for innovation is almost unbounded. MCU projects are almost free in comparison and take months or even just weeks to finish, but they are limited by the third-party chips they run on.
To read the full article, click here
Related Semiconductor IP
- Bluetooth Low Energy 6.0 Digital IP
- Ultra-low power high dynamic range image sensor
- Flash Memory LDPC Decoder IP Core
- SLM Signal Integrity Monitor
- Digital PUF IP
Related White Papers
- Using customizable MCUs to bridge the gap between dedicated SoC ASSPs, ASICs and FPGAs: Part 1
- Using ARM Processor-based Flash MCUs as a Platform for Custom Systems-on-Chip
- Custom ASICs for Internet of Industrial Things (IoIT)
- Custom Corner Characterization for Optimal ASIC/SoC Designs
Latest White Papers
- How Next-Gen Chips Are Unlocking RISC-V’s Customization Advantage
- Efficient Hardware-Assisted Heap Memory Safety for Embedded RISC-V Systems
- Automatically Retargeting Hardware and Code Generation for RISC-V Custom Instructions
- How Mature-Technology ASICs Can Give You the Edge
- Exploring the Latest Innovations in MIPI D-PHY and MIPI C-PHY