Bridging the gap between custom ASICs and ARM-based MCUs
Mark Saunders, Senior Product Marketing Manager, Cypress Semiconductor
EETimes (10/4/2010 5:53 PM EDT)
One perspective for thinking of the embedded world is as a spectrum of complexity ranging from ASIC to MCU. ASIC designs are enormously expensive and take years to complete but the potential for innovation is almost unbounded. MCU projects are almost free in comparison and take months or even just weeks to finish, but they are limited by the third-party chips they run on.
To read the full article, click here
Related Semiconductor IP
- HBM4 PHY IP
- 10-bit SAR ADC - XFAB XT018
- eFuse Controller IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
Related Articles
- Using customizable MCUs to bridge the gap between dedicated SoC ASSPs, ASICs and FPGAs: Part 1
- Using ARM Processor-based Flash MCUs as a Platform for Custom Systems-on-Chip
- Custom ASICs for Internet of Industrial Things (IoIT)
- Custom Corner Characterization for Optimal ASIC/SoC Designs
Latest Articles
- Making Strong Error-Correcting Codes Work Effectively for HBM in AI Inference
- Sensitivity-Aware Mixed-Precision Quantization for ReRAM-based Computing-in-Memory
- ElfCore: A 28nm Neural Processor Enabling Dynamic Structured Sparse Training and Online Self-Supervised Learning with Activity-Dependent Weight Update
- A 14ns-Latency 9Gb/s 0.44mm² 62pJ/b Short-Blocklength LDPC Decoder ASIC in 22FDX
- Pipeline Stage Resolved Timing Characterization of FPGA and ASIC Implementations of a RISC V Processor