Agile Design for Hardware, Part II
David Patterson and Borivoje NikoliÄ, UC Berkeley
EETimes (7/30/2015 07:00 AM EDT)
In the second of a three-part series, two Berkeley professors suggest its time to apply Agile design techniques to hardware.
We asked readers of Part I to guess the cost of a prototype run of 28 nm chips, as Agile development relies on a sequence of interim prototypes versus the One Big Tapeout of the traditional Waterfall process. Here are the results:
The surprisingly low manufacturing cost of prototype chips—one fifth the readers’ estimate—means Agile development is eminently affordable, even for academics. (See www.AgileSoC.com for more evidence.) It also calls into question the current high cost of designing SoCs using the Waterfall process. Having established Agile’s viability, based on our experience we propose four guidelines to lower development costs.
To read the full article, click here
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- Bluetooth Low Energy 6.0 Digital IP
- Ultra-low power high dynamic range image sensor
- Neural Video Processor IP
- Flash Memory LDPC Decoder IP Core
Related White Papers
- Agile Design for Hardware, Part I
- How to design secure SoCs, Part II: Key Management
- QiMeng: Fully Automated Hardware and Software Design for Processor Chip
- How to design secure SoCs, Part III: Secure Boot
Latest White Papers
- Enabling Space-Grade AI/ML with RISC-V: A Fully European Stack for Autonomous Missions
- CANDoSA: A Hardware Performance Counter-Based Intrusion Detection System for DoS Attacks on Automotive CAN bus
- How Next-Gen Chips Are Unlocking RISC-V’s Customization Advantage
- Efficient Hardware-Assisted Heap Memory Safety for Embedded RISC-V Systems
- Automatically Retargeting Hardware and Code Generation for RISC-V Custom Instructions