Will 1.4-nm help Samsung catch up with TSMC, IFS?
By Majeed Ahmad, EDN (November 6, 2023)
Samsung, playing a distant second to TSMC for quite some time, has vowed to launch the 1.4-nm chip manufacturing node by 2027, leapfrogging both TSMC and Intel Foundry Services (IFS) by a wide margin. The South Korean electronics conglomerate is also confident about producing the 2-nm chips in 2025 as planned.
Both 1.4 nm and 2 nm chips will be fabricated using the gate-all-around (GAA) technology that Samsung pioneered on its 3-nm chips released this year. Archrivals TSMC and IFS will transition from Fin field-effect transistors (FinFETs) to GAA transistors at their 2-nm nodes due for commercial launch in 2025 and 2024, respectively.
Related Semiconductor IP
- 1-port Receiver or Transmitter HDCP 2.3 on HDMI 2.1 ESM
- HDMI 2.0/MHL RX Combo 1P PHY 6Gbps in TSMC 28nm HPC 1.8V, North/South Poly Orientation
- HDMI 2.0 RX PHY in SS 8LPP 1.8V, North/South Poly Orientation
- HDMI 2.0 RX Controller with HDCP
- HDMI 2.0 RX 4P PHY 6Gbps in TSMC 28nm HPM 1.8V, North/South Poly Orientation
Related News
- Eliyan Ports Industry’s Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Intel's Custom Foundry Will Manufacture Future Panasonic System-on-Chips Using Intel's 14nm Low-Power Process
- Leading edge technology company in India will Design, Build and License Semiconductor IP products and Services in 14nm Technology
- New Highly Optimised LDPC Decoder in Software for Intel's FlexRAN Reference Software Will Increase Throughput by up to 3X
Latest News
- Andes Technology Collaborates with Lauterbach to Deliver RISC-V Trace Solution
- Siliconally Releases SinglePHY 100BASE-T1 22FDX, an Automotive Ethernet PHY IP
- Alphawave Semi Drives Innovation in Hyperscale AI Accelerators with Advanced I/O Chiplet for Rebellions Inc
- sureCore now licensing its CryoMem range of IP for Quantum Computing
- GlobalFoundries and IDEMIA Secure Transactions to Enable Next-Generation Smart Card IC on GF 28ESF3 Platform