Will 1.4-nm help Samsung catch up with TSMC, IFS?
By Majeed Ahmad, EDN (November 6, 2023)
Samsung, playing a distant second to TSMC for quite some time, has vowed to launch the 1.4-nm chip manufacturing node by 2027, leapfrogging both TSMC and Intel Foundry Services (IFS) by a wide margin. The South Korean electronics conglomerate is also confident about producing the 2-nm chips in 2025 as planned.
Both 1.4 nm and 2 nm chips will be fabricated using the gate-all-around (GAA) technology that Samsung pioneered on its 3-nm chips released this year. Archrivals TSMC and IFS will transition from Fin field-effect transistors (FinFETs) to GAA transistors at their 2-nm nodes due for commercial launch in 2025 and 2024, respectively.
To read the full article, click here
Related Semiconductor IP
- RVA23, Multi-cluster, Hypervisor and Android
- 64 bit RISC-V Multicore Processor with 2048-bit VLEN and AMM
- NPU IP Core for Mobile
- RISC-V AI Acceleration Platform - Scalable, standards-aligned soft chiplet IP
- H.264 Decoder
Related News
- Intel's Custom Foundry Will Manufacture Future Panasonic System-on-Chips Using Intel's 14nm Low-Power Process
- Leading edge technology company in India will Design, Build and License Semiconductor IP products and Services in 14nm Technology
- Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
- Exec tried to set up copy-cat Samsung fab in China
Latest News
- InCore Unveils SoC Generator Platform: From Idea to FPGA Validation in Minutes; Demonstrates Silicon Proof of Auto-Generated SoC
- Safety Without Security Is an Illusion in the Age of Autonomous Vehicles
- M31 Ranked in the Top 5% of TPEx-Listed Companies in the Corporate Governance Evaluation for Four Consecutive Years
- SmartDV Introduces Advanced H.264 and H.265 Video Encoder and Decoder IP
- Volantis Unveils Photonic Compute Platform for the AI Era; Raises $9M in Seed Round With Alex Wang, Trevor Blackwell, and Others