Why China still can't create the next Texas Instruments
Junko Yoshida, EETimes
9/8/2012 10:09 PM EDT
So far, it hasn't come close. For now, there’s not much chance it will.
With surprising candor, Chinese executives here acknowledge last week (Sept. 7) that they face a long road ahead before China can give birth to a chip company of TI’s caliber. An industry panel including Chinese fabless CEOs, executives working for EDA vendors and a foundry along with a professor from Tsinghua University, debated the matter during the China Fabless CEO Forum & Awards event, organized by EE Times-China, a sister publication of EE Times.
To read the full article, click here
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related News
- Texas Instruments debuts first ARM Cortex-A8 processors for industrial computing applications
- Sundance Features New Texas Instruments TMS320C6472 Multicore DSP in its EVP6472 Development Platform
- Mentor Graphics Delivers Optimized Android Development System for the OMAP35x Processors from Texas Instruments
- S3 Group and Texas Instruments Deliver First Continua Certified Platform for Faster Development of Telehealth Devices
Latest News
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
- Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs