TSMC shuns high-NA EUV lithography
By Peter Clarke, eeNews Europe | April 29, 2025
Foundry TSMC does not need to use high-NA extreme ultraviolet lithography tools for the manufacture of chips on its A14 (1.4nm) process according to reports from the TSMC North America Technology Symposium.
The company introduced the A14 process at the symposium saying it is expected to enter production in 2028. It has previously been stated that an A16 process due to appear late 2026 and that too does not require a high-NA EUVL tool.
To read the full article, click here
Related Semiconductor IP
- TSMC CLN3FFP HBM4 PHY
- Wi-Fi 7(be) RF Transceiver IP in TSMC 22nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- HBM3 PHY V2 (Hard) - TSMC N3P
- USB4 Gen3 x2-lane PHY, TSMC N5, 1.2V, N/S orientation, type-C
Related News
- TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
- TSMC Says Immersion Lithography Nearly Production Ready
- MAPPER and TSMC Take Next Step in Exploring Multiple E-beam Lithography for IC Manufacturing at 22 nanometer node and Beyond
- IMEC presents functional 22nm SRAM cells fabricated using EUV technology
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack