TSMC Files Complaints Against GlobalFoundries in U.S., Germany and Singapore for Infringement of 25 Patents to Affirm its Technology Leadership and to Protect Its Customers and Consumers Worldwide
Hsinchu, Taiwan R.O.C., Oct 1, 2019 - TSMC, the world’s leading global innovator in semiconductor manufacturing, filed multiple lawsuits on September 30, 2019 against GlobalFoundries in the United States, Germany and Singapore for its ongoing infringement of 25 TSMC patents by at least its 40nm, 28nm, 22nm, 14nm, and 12nm node processes. In the complaints, TSMC demands injunctions to stop GlobalFoundries’ manufacture and sale of infringing semiconductor products. TSMC also seeks substantial monetary damages from GlobalFoundries for its sale of infringing semiconductor products and unlawful use of TSMC’s patented semiconductor technologies.
The 25 TSMC patents in the complaints relate to a diverse set of technologies, including FinFET designs, shallow trench isolation techniques, double patterning methods, advanced seal rings and gate structures, and innovative contact etch stop layer designs. These specific technologies cover the core features of mature and advanced semiconductor manufacturing processes. The patents at issue comprise just a small portion of TSMC’s extensive portfolio that numbers more than 37,000 granted patents worldwide. TSMC was ranked one of the top 10 companies for U.S. patent grants last year, for the third consecutive year.
TSMC pioneered the dedicated semiconductor foundry model, enabling an entire fabless IC design industry worth hundreds of billions of dollars in the United States. Furthermore, TSMC plays a critical role in facilitating the global semiconductor supply chain. For example, TSMC collaborates with dozens of U.S.-based equipment suppliers, intellectual property (IP) core providers and electronic design automation (EDA) vendors. TSMC procured about US$20 billion in equipment and services from U.S. suppliers over the past 5 years. TSMC also spurs the next generation of semiconductor technology by working closely with U.S.-based customers, suppliers and prestigious universities. TSMC subsidiaries operate a manufacturing site in Washington State along with offices in California and Texas with over a thousand employees.
“TSMC’s patents reflect decades and tens of billions of dollars of investments in innovation, resulting in TSMC’s significant contribution to advancements in semiconductor manufacturing technology,” said Sylvia Fang, Vice President and General Counsel for TSMC. “TSMC’s lawsuits seek to protect our reputation, our significant investments, our nearly 500 customers, and consumers worldwide to ensure everyone benefits from the most advanced semiconductor technologies that enable a wide range of applications such as mobile, 5G, AI, IoT and high performance computing, which are critically important to the public interest.”
Related Semiconductor IP
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- RAM 8b, 16b, and 32b data widths - TSMC 180nm
- 1.2GHz General Purpose PLL for TSMC 0.18u Processes
- General Purpose PLL for TSMC 180nm
- Integrated Oscillator - TSMC 180n
Related News
- Qualcomm Files Patent Infringement Complaints against Meizu in China
- TSMC Will Vigorously Defend its Proprietary Technology in Response to GlobalFoundries Complaints
- Cadence Successfully Tapes Out Tensilica SoC on GLOBALFOUNDRIES 22FDX Platform Using Adaptive Body Bias Feature
- GLOBALFOUNDRIES and Cadence Add Machine Learning Capabilities to DFM Signoff for GF's Most Advanced FinFET Solutions
Latest News
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- The world’s first open source security chip hits production with Google
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing