The TSMC and Huawei Announcements Are Not as Linked as You May Think
By Jim McGregor, EETimes (May 22, 2020)
The industry was rocked last week by two U.S. announcements that seem interconnected. The first was the Trump Administration’s announcement banning any U.S chip and equipment sales to Huawei and ZTE. The second was the announcement that TSMC would build a state-of-the-art fab in Arizona. While national security may be a common thread in the two announcements, the factors and ramifications of the individual announcements are much greater.
War on Huawei and ZTE
The U.S. government has fined, banned, and now embargoed Huawei and ZTE for multiple reasons, including violating export controls of technology shipments to embargoed and sanctioned countries and charges of intellectual property (IP) theft. To be fair, China’s policy of requiring foreign countries to form a joint venture with a Chinese company and to share IP in order to do business in the country has been an open door to IP theft. Huawei recently accused the U.S. of implementing protectionary policies — when navigating Chinese protectionism has been part of doing business in China for decades.
To read the full article, click here
Related Semiconductor IP
- USB 20Gbps Device Controller
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
- AGILEX 7 R-Tile Gen5 NVMe Host IP
Related News
- InterDigital Files Complaint Against Nokia, Huawei and ZTE With International Trade Commission
- Huawei and Intel Collaborate on LTE TDD
- Tensilica and Huawei Expand Strategic Relationship for Next-Generation Products
- Sequans and Huawei Collaborate to Advance LTE Broadcast Technology
Latest News
- MIPS Appoints Alan Li as Head of Business Development to Accelerate China Growth
- BrainChip Expands Global Reach, Announces Akida Boards and AI Development Kits Available at DigiKey
- Qualitas Semiconductor Successfully Demonstrates Live UCIe PHY IP at AI Infra Summit 2025
- Silicon Creations Announces 1000th Production FinFET Tapeout at TSMC and Immediate Availability of Full IP Library on TSMC N2 Technology
- Intel and NVIDIA to Jointly Develop AI Infrastructure and Personal Computing Products