Huawei and Intel Collaborate on LTE TDD
Companies creating a China-based IOT lab to accelerate development of the ecosystem
Beijing, China, April 27 , 2012 -- Intel Corporation and Huawei, a leading global information and communication technology (ICT) solutions provider, today announced a collaboration to advance the development of interoperability testing and deployment of LTE TDD solutions. The two companies will establish joint lab set-up based in China for IOT (Interoperability Test) and fast implementation of LTE TDD technology.
"Huawei has been committed to LTE TDD commercial deployment worldwide," said Deng Taihua, president LTE TDD & WiMAX &TDS wireless networks, Huawei. "We will continuously invest in LTE TDD research and deployment as well as the global expansion of LTE TDD networks. We are excited to partner with Intel to accelerate the development of our technology and provide our customers with leading LTE TDD solutions."
The collaboration will utilize Huawei's expertise in LTE TDD network infrastructure technologies and Intel’s innovative and cost-optimized mobile communication platforms to expedite the maturity and deployment of LTE TDD. By connecting directly to the Huawei’s infrastructure Intel will carry out end-to -end testing of its mobile platforms in a real life environment.
"Collaborative innovation is Intel’s strategy in China," said W.K Tan, VP of Intel IAG & Head of MCG, China. "The engagement with Huawei will take advantage of the two companies’ strengths and leading technologies. We are committed to working together with partners in China to build a healthy LTE TDD ecosystem within China and even beyond."
Related Semiconductor IP
- HBM4 PHY IP
- eFuse Controller IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- Sequans Unveils Next-Generation FDD and TDD LTE Chips and Global LTE Platforms
- Sequans and Huawei Collaborate to Advance LTE Broadcast Technology
- Intel Foundry and Arm Announce Multigeneration Collaboration on Leading-Edge SoC Design
- Intel and UMC Announce New Foundry Collaboration
Latest News
- LTSCT and Andes Technology Sign Strategic IP Licensing Master Agreement to accelerate RISC-V Based Advanced Semiconductor Solutions
- Global Semiconductor Sales Increase 29.8% Year-to-Year in November
- BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST
- HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments
- ASICLAND Secures USD 17.6 Million Storage Controller Mass Production Contract