TSMC to Build 3nm Fab in Tainan Science Park
Hsinchu, Taiwan, R.O.C. – Sept. 29, 2017 – TSMC today announced that, following careful evaluation, the Company’s planned advanced 3nm fab will be located in the Tainan Science Park to fully leverage the company’s existing cluster advantage and the benefit of a comprehensive supply chain. TSMC recognizes and is grateful for the government’s clear commitments to resolve any issues, including land, water, electricity and environmental protection.
Related Semiconductor IP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
Related News
- Report: TSMC's 3nm Fab Could Cost $20 Billion
- Alphawave Semi Launches Industry's First 3nm UCIe IP with TSMC CoWoS Packaging
- ESMC Breaks Ground on Dresden Fab
- Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology
Latest News
- Sofics and Alcyon Photonics Partner to Support Next-Generation Photonic Systems
- QuickLogic Appoints Quantum Leap Solutions as Authorized Sales Representative
- Cadence and NVIDIA Expand Partnership to Reinvent Engineering for the Age of AI and Accelerated Computing
- Cadence and Google Collaborate to Scale AI-Driven Chip Design with ChipStack AI Super Agent on Google Cloud
- Analog Bits Demonstrates Real-Time On-Chip Power Sensing and Delivery on TSMC N2P Process at TSMC 2026 Technology Symposiums