After TSMC fab in Japan, advanced packaging facility is next
By Majeed Ahmad, EDN (March 18, 2024)
Japan’s efforts to reboot its chip industry are likely to get another boost: an advanced packaging facility set up by TSMC. That seems a logical expansion to TSMC’s $7 billion front-end chip manufacturing fab built in Kumamoto on Japan’s southern island Kyushu.
In other words, a back-end packaging facility will follow the front-end fab to complement the chip manufacturing ecosystem in Japan amid considerations to diversify semiconductor supply chains beyond Taiwan due to geopolitical tensions. Trade media has been abuzz about TSMC setting up an advanced packaging plant and a new Reuters report supports this premise.
To read the full article, click here
Related Semiconductor IP
- TSMC CLN3FFP HBM4 PHY
- Wi-Fi 7(be) RF Transceiver IP in TSMC 22nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- HBM3 PHY V2 (Hard) - TSMC N3P
- USB4 Gen3 x2-lane PHY, TSMC N5, 1.2V, N/S orientation, type-C
Related News
- TSMC in "Due Diligence" on Possible Japan Fab
- TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder
- Intel Foundry Services Head Sees Advanced Packaging as "On Ramp" to Growth
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
Latest News
- Jim Keller: ‘Whatever Nvidia Does, We’ll Do The Opposite’
- FlexGen Streamlines NoC Design as AI Demands Grow
- IntoPIX Presents Its New Titanium Software Suite: Empowering AV-Over-IP Workflows With Speed, Quality & Interoperability
- Global Semiconductor Sales Increase 2.5% Month-to-Month in April
- Speedata Raises $44M to Launch First-Ever Chip Designed Specifically for Accelerating Big Data Analytics - Compute's Second Largest Workload