TI steering OMAP to embedded
Dylan McGrath, EETimes
9/26/2012 3:36 PM EDT
SAN FRANCISCO—Executives from Texas Instruments Inc. said Tuesday (Sept. 25) the company would shift its R&D investment on the OMAP applications processor to focus more on the embedded market and less on smartphones and media tablets.
OMAP has been successful in securing design wins in smartphones and tablets, including Motorola Droid handsets and Amazon's Kindle Fire tablet. But, faced with stiff competition from the likes of Qualcomm Inc. and Nvidia Corp., TI executives have said the fact that market leaders Apple Inc. and Samsung Electronics Co. Ltd. use their own internally designed processors makes the mobile market less attractive.
To read the full article, click here
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related News
- Accelerated Technology Announces Nucleus RTOS Support for OMAP Enhanced Application Processors from TI
- TI Meets Demands of Portable Data Terminal Market With Feature-Rich OMAP Platform
- D2 Technologies Launches ARM VoIP Solution on TI OMAP Platforms
- Xilinx Showcases Handset Demonstration Platform With TI OMAP Processor Compatibility
Latest News
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
- Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs