Long, bumpy transition seen for USB 3.0

OEMs fear delays in Intel, Microsoft support

Rick Merritt, EETimes
(09/21/2009 6:00 AM EDT)

SAN JOSE, Calif. — The Intel Developer Forum is expected to generate buzz around SuperSpeed USB this week, but the transition to the 5 GHz interface may be slower and bumpier than many would hope due to cost, power and support issues.

At least two sources said Intel Corp. may not hit its schedule for sampling PC chip sets supporting USB 3.0 in the first quarter 2010, a key trigger for a volume market ramp. One source said the chip sets could be delayed as much as a year.

Intel declined to comment on its USB 3.0 plans prior to this week's IDF. Typically, Intel triggers the volume ramp of new interfaces such as USB 3.0 by supporting the technology in its PC chip sets, enabling a generation of desktops and notebooks and creating an opportunity for supporting peripherals.

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