Sonics, Inc. completes $10M investment; brings series C total to $35M

Mountain View, Calif. — June 22, 2004 — Sonics, Inc., a leading provider of SoC (system-on-chip) architectures and SMART Interconnect IP products that reduce the time, cost and risk of developing complex SoC devices, announced today that the company has closed $10 million of additional investment from a mix of new corporate sources and existing investors. The new investments in the privately held Sonics bring the total Series C funding to $35 million. The new corporate investor is Toshiba Corporation, and the existing Sonics investors include Smart Technology Ventures, TL Ventures, and Easton Hunt Capital Partners, L.P.

“Sonics SMART Interconnect IP products have been widely adopted by market leaders and is currently shipping in millions of units per month,” said Grant Pierce, president and CEO of Sonics, Inc. “This new investment from outstanding industry leader Toshiba will accelerate continued success with customers as we refine our technology, adapt it to market leading design flows, and leverage growth opportunities in international markets.”

Mr. Takashi Yoshimori, Technology Executive, Toshiba Corporation said, “As we move from our market-leading 90-nanometer production capabilities to next generation 65-nanometer process technologies, Sonics IP will help us develop feature-rich, high-volume SOCs that will fuel future market growth.” Sonics has recently strengthened its international operations with the establishment of a Sonics office in Japan and new relationships with leading Asia-Pacific sales representatives serving China, Taiwan and Korea.

Sonics’ SiliconBackplane™ III SMART Interconnect IP is the communications fabric that connects high performance IP cores, such as microprocessors, DSPs, and hardware accelerators, with a high degree of silicon efficiency and high data throughput. The Sonics3220™ is the industry’s first non-blocking peripheral interconnect that connects large numbers of peripheral cores dispersed across the die while providing predictable and rapid time to timing closure. MemMax™ Memory Scheduler is a complex arbitration processor designed to maximize efficiency and throughput to and from DRAM.

About Sonics, Inc.

Sonics, Inc. is a leading provider of SOC architectures and SMART Interconnect Intellectual Property (IP) that accelerate the development of complex SOCs, reduce development costs and increase the reusability of IP. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics architectures, IP products and methodologies in SOCs used in leading products in the wireless, digital multimedia and communications markets. Sonics customers have experienced dramatic reduction in time to market, from years to months, while enjoying savings in design and manufacturing costs. Sonics is a privately held company funded by Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital Partners, L.P, Globespan Capital Partners, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com.

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SiliconBackplane, Sonics3220, and MemMax are trademarks of Sonics, Inc.