Sckipio Technologies Completes $10M Investment Round to Create G.fast Modem Chips
G.Fast’s 1Gbps Broadband Quickly Becoming a Reality
Tel Aviv, Israel – December 11, 2013 − Sckipio Technologies today announced completion of a $10M investment from four venture funds − Gemini Israel Ventures, Genesis Partners, Amiti Capital, and Aviv Ventures − to build ultra-high speed G.fast broadband modem semiconductors. These leading U.S. and Israeli investors are betting that Sckipio will become the leading chip company to enable G.fast – the new 1Gbps broadband standard soon to be announced by the ITU. Sckipio is actively working with multiple tier-1 telcos globally to address the pent-up demand for affordable ultra-fast broadband using G.fast.
“Sckipio is poised to be the leader in G.fast,” said David Baum, co-founder and CEO of Sckipio Technologies. “The standard is now ready and so are we. We’ve got a complete team with the relevant expertise in G.fast and the capital needed to deliver the right G.fast solutions quickly.”
Sckipio brings a deep understanding of the new ITU recommendation. As an active member of the G.fast ITU study group, Sckipio provided over 20% of all the contributions to the G.fast recommendation.
“G.fast is the best hope for telcos to affordably deliver 1Gbps to consumers,” said Oliver Johnson, CEO of Point Topic, a leading broadband market research firm. “We expect G.fast to be broadly deployed quickly because telcos need an effective alternative to cable and G.fast appears to have everything these telcos need to succeed.”
G.fast provides several key advantages over existing broadband technologies. The standard:
- Provides up to 1 Gbps of broadband access over existing phone lines for up to 250 meters
- Lowers the cost to deploy fiber-like speeds by as much as 90%
- Speeds up Telco take rates by eliminating home installations and installer-induced delays
- Simplifies deployments by using remote power feed, which eliminates complex permissions to power FTTdp field units
- Delivers Telcos 3-4x faster ROI when delivering next-generation broadband solutions
- Consumes comparatively little power, making it both green and low-cost to deploy
- Provides flexible upstream/downstream partitioning of available bandwidth allowing support for new and advanced broadband services
“We expect G.fast-based solutions to ship in 2014,” said Baum.
Related Semiconductor IP
- HBM4 PHY IP
- eFuse Controller IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- Arteris Helps Sckipio Deliver the World's First G.fast Modems
- Sckipio G.fast Technology Zooms Ahead with Arteris FlexNoC IP for Ultra-Fast Broadband
- The World's First G.fast Chipsets Announced by Sckipio
- Sckipio Licenses and Deploys CEVA-XC Communications DSP in World's First G.fast Chipsets
Latest News
- BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST
- LTSCT and Andes Technology Sign Strategic IP Licensing Master Agreement to accelerate RISC-V Based Advanced Semiconductor Solutions
- Global Semiconductor Sales Increase 29.8% Year-to-Year in November
- HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments
- ASICLAND Secures USD 17.6 Million Storage Controller Mass Production Contract