Rapport Adopts LogicVision Embedded Test Solutions for Next Generation Low-Power Device
SAN JOSE, Calif. — December 4, 2006 — LogicVision, Inc. (NASDAQ: LGVN), a leading provider of semiconductor test and yield learning solutions, today announced that Rapport, Inc., the technology leader in low-cost, dynamically configurable, massively parallel chips for compute-intensive applications at low power, has adopted LogicVision’s leading edge memory BIST solutions for next-generation Kilocore™ Architecture-based products.
The Rapport Kilocore devices address the shortcomings of conventional chips by putting hundreds or thousands of high performance parallel processing elements in small, low power consumption chips. These chips feature the most advanced, dynamic architecture available today in working silicon and can be dynamically reconfigured in real-time for consumer electronics, mobile gaming, homeland security, server components, image processing, and suitcase supercomputing. LogicVision’s Embedded Memory Test provides a unique built-in memory test solution for this type of device.
“LogicVision’s Memory BIST solution gives us the flexibility we need to effectively and efficiently test the different embedded memories in next-generation Rapport Kilocore Architecture devices,” said Dr. Benjamin Levine, Director of Chip Development at Rapport, Inc.“ LogicVision offers a solution that allows us to hierarchically group and test different types and sizes of memories and allows us to select the best options for testing each one. LogicVision also provides us with the tools to easily integrate their BIST solutions into our design flow with a minimum of effort.”
“As SoC design teams incorporate more embedded memories scattered throughout their device, they demand more automation and flexibility from their memory BIST solutions,” said Farhad Hayat, vice president of marketing at LogicVision. "As a leader in Memory BIST solutions, we provide a streamlined flow for implementing an optimum test strategy, when dealing with hundreds of memories within a single device, which helps customers such as Rapport meet their stringent manufacturing test requirements.”
Rapport, Inc., is the technology leader in developing next-generation, low-cost massively parallel chips with its Kilocore™ Architecture Computing Fabric. These chips can be dynamically configured for compute-intensive applications at low power, thereby addressing high-growth, feature-rich markets. The company is based in Redwood City, California. For more information, visit: http://www.kilocore.com.
About LogicVision, Inc.
LogicVision, Inc. provides unique test and yield learning capabilities in the design for manufacturing space. These capabilities enable its customers, leading semiconductor companies, to more quickly and efficiently learn to improve product yields. The company’s advanced Design for Test (DFT) product line, ETCreate, works together with ETAccess and Yield Insight yield learning applications to improve profit margins by reducing device field returns, reducing test costs, and accelerating both time to market and time to yield. LogicVision solutions are used in the development of semiconductor ICs for products ranging from digital consumer goods to wireless communications devices and satellite systems. LogicVision was founded in 1992 and is headquartered in San Jose, Calif. For more information visit www.logicvision.com.
Related Semiconductor IP
- 5G-NTN Modem IP for Satellite User Terminals
- HBM4E Controller IP
- 14-bit 12.5MSPS SAR ADC - Tower 65nm
- 5G-Advanced Modem IP for Edge and IoT Applications
- TSN Ethernet Endpoint Controller 10Gbps
Related News
- Spectral Design & Test Inc. Announces 3rd Generation 45RFSOI Low Power SRAM Targeted at the 5G Mobile Device SoC Market
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- USB 4.0 Host and Device Controller IP Cores unleashing the Power of High-Speed Connectivity with tunnelling of Display Port and PCIe is now available for Licensing
- Ceva Introduces its Next Generation Low Power Ultra-Wideband IP for FiRa 2.0 to Provide Highly Accurate and Reliable Wireless Ranging Capabilities for Consumer and Industrial IoT Applications
Latest News
- Marvell Extends ZR/ZR+ Leadership with Industry-first 1.6T ZR/ZR+ Pluggable and 2nm Coherent DSPs for Secure AI Scale-across Interconnects
- BrainChip Announces Neuromorphyx as Strategic Customer and Go-to-Market Partner for AKD1500 Neuromorphic Processor
- SCI Semiconductor Announces First Silicon of Cybersecure MCU, ICENI™
- Allen Wu on Disrupting $100M Cost of Building Custom AI Chips
- GUC Monthly Sales Report – February 2026