Philips announces first 'fully-integrated' telematics processor
Philips announces first 'fully-integrated' telematics processor
By Semiconductor Business News
February 8, 2002 (5:03 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020208S0097
EINDHOVEN, the Netherlands -- Philips Semiconductors today said it is now sampling the first "full-integrated" telematics processor. The SAF3100 combines a microcontroller core, 12-channel GPS baseband circuitry, dual 14-bit analog-to-digital converter, embedded RAM, CAN-bus controller, and high-speed UARTs for interfacing to a cellular phone. "Ease of integration and cost will dramatically affect how quickly telematics solutions are brought to the mass market," said Niko Veenstra, senior marketing manager for Car Infotainment Systems at Philips Semiconductors. "We are the first company to offer a cost-effective, fully-integrated telematics processor, already compatible with a corresponding front-end device." Philips' SAF3100 telematics processor is being aimed at global positioning satellite (GPS) positioning and tracking applications, off-board navigation, automatic emergency call systems, and remote-controlled vehicle functions and diagn ostics. The dual 14-bit A-to-D converter enables connection to a gyroscope for dead-reckoning positioning of vehicles, said the Dutch chip maker. The SAF3100 is compatible with Philips' UAA1570 GPS front-end device. Philips said the telematics processor will also be compatible with a new UAF1572 GPS front-end, which has been designed to dramatically reduce external component count and overall cost of materials while lowering power consumtion. The new front-end device will be available in the third quarter. Samples of the telematics processor are available now and volume production is scheduled to begin this month, said Philips. Pricing on the processor was not immediately available.
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- 1.8V/3.3V GPIO With I2C Compliant ODIO in GF 55nm
- Verification IP for UALink
Related News
- CEA-Leti Builds Fully Integrated Bio-Inspired Neural Network with RRAM-Based Synapses & Analogue Spiking Neurons
- AccelerComm Unveils Fully Integrated PUSCH Decoder to Supercharge 5G NR for Performance-Critical Channels
- Orca Systems Announces World's First Fully Integrated SoC Solution for Direct-to-Satellite IoT Connectivity
- Philips develops one-chip stereo radio for embedded use in consumer products
Latest News
- 2Q25 Foundry Revenue Surges 14.6% to Record High, TSMC’s Market Share Hits 70%
- EXTOLL received GlobalFoundries Award for “Interface IP Partner of the Year”
- AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset
- GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity
- GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications