Chip execs see 20 nm variants, 3-D ICs ahead
Rick Merritt, EETimes
4/27/2012 12:43 AM EDT
Those were just two data points from wide ranging discussions at the GSA Silicon Summit here. Separately, executives said a variety of 3-D ICs will hit the market in 2014 despite numerous challenges, and CMOS scaling is slowing down but still viable through a 7 nm node.
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