NEC plans to use Tensilica's DSP engine in system-level ICs
NEC plans to use Tensilica's DSP engine in system-level ICs
By Semiconductor Business News
November 15, 2000 (8:54 a.m. EST)
URL: http://www.eetimes.com/story/OEG20001115S0003
SANTA CLARA, Calif.--Tensilica Inc. here today said NEC Corp. has opted to upgrade its licensing agreement with the company to gain access to new Xtensa III processor core technology and the Vectra digital signal processor (DSP) engine. Six months ago, NEC began implementing system-on-chip designs using Xtensa technology, and the result encouraged the Japanese company to extend its licensing agreement to cover the new DSP engine, said Bernie Rosenthal, vice president of marketing and business development at Tensilica. Makoto Tazaki, general manager of NEC's Network Node Division, said his company has used Tensilica's cores to implement custom processors for next-generation communication products and now design teams will be able to accelerate their development cycles with the Vectra DSP engine. During June, Tensilica disclosed the Vectra DSP technology, saying it was capable of executing around 400 million floating point operations per second (MFLOPS). The DSP engine requires just 25,000 gates of logic, taking up 1.2-to1.5 square millimeters of die space using a 0.18-micron process, according to the three-year-old Santa Clara company (see June 14 story). Separately, Tensilica today announced a licensing agreement with the Media-Centric Low-Power LSI Design Project at Osaka University and Kyoto University. The project will use the Tensilica's processor generator for the development of a variety of advanced video and audio processing systems for mobile systems applications. To date, Tensilica has inked licensing pacts with Cisco, Fujitsu, NEC, Galileo Technology, NTT, Berkeley Wireless Research Center, Onex Communications, TranSwitch, and Zilog.
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 10-bit Pipeline ADC - Tower 180 nm
- NoC Verification IP
- Simulation VIP for Ethernet UEC
- Automotive Grade PLLs, Oscillators, SerDes PMAs, LVDS/CML IP
Related News
- Fortemedia Licenses Tensilica Fusion F1 DSP for Use in Always-On Smart Microphone Processor
- AMD: At 45 nm and beyond ICs require high level HW/SW tools
- Tenison Delivers System Level Use Of IP With VTRAC Technology
- LogicVision Announces Expanded Use of Embedded Test Solutions by NEC Electronics for SoC Designs
Latest News
- Presto Engineering Group Acquires Garfield Microelectronics Ltd, Creating Europe’s Most Comprehensive ASIC Design to Production One-Stop-Shop
- Qualitas Semiconductor Demonstrates Live of PCIe Gen 6.0 PHY and UCIe v2.0 Solutions at ICCAD 2025
- WAVE-N v2: Chips&Media’s Custom NPU Retains 16-bit FP for Superior Efficiency at High TOPS
- Quintauris releases RT-Europa, the first RISC-V Real-Time Platform for Automotive
- PQShield's PQCryptoLib-Core v1.0.2 Achieves CAVP Certification for a broad set of classical and post-quantum algorithms