Mobile Semiconductor Introduces a 22nm FDX (FDSOI) ULP Memory Compiler with Market Leading Features
December 20, 2018 -- Today, Mobile Semiconductor announced their new 22nm FDX ULP (Ultra Low Power) Memory Compiler complete with a comprehensive set of features that cement their leadership position in FDX Memory Compiler offerings.
This new Memory Compiler offers an Ultra-Low Power mode at 0.65V that is useful to a wide range of wearable and battery powered devices. The 22nm FDX ULP joins their expanding 22nm FDX Memory Compiler family that currently covers a wide range of speeds, power requirements, and ultra-low leakage offerings. The 22nm ULP product draws from the expertise developed over the past three years with our successful 28nm and 55nm Memory Compilers.
Cameron Fisher, CEO and Founder of Mobile Semiconductor, said, “We believe our approach to anticipating the needs of engineers, and building in industry leading features, set us apart. Examples mentioned by current customers includes low power level shifters and isolation cells. Without these features, the designer cannot power off the memory entirely resulting in wasted energy and a substandard product. Mobile Semiconductor Memory Compilers truly allow for complete power down and rapid start-up.”
The Mobile Semiconductor / GlobalFoundries 22FDX platform include 100% of what a design team demands:
- 0.65V and 0.5V Logic Support
- Integrated Power Solutions
- Output Isolation
- Multiple Power Modes
- Single Port and Register File Compilers
- Pseudo Dual Port Support
- Flexible Reverse Body Bias Support
Fisher continued, “Mobile Semiconductor remains the leader in providing low power memory complier solutions. But it’s not enough to have a feature rich offering on one product like the 22nm FDX ULP, we also believe that it’s our obligation to provide a range of other products such as 28nm and 55nm AND to design them with the features that best support the demands of the market segments.”
For more information please contact Mobile Semiconductor at info@mobile-semi.com
About Mobile Semiconductor:
Mobile Semiconductor is in Seattle, Washington with a design center in Williston, Vermont. The company develops SRAM, ROM and Register File compilers optimized for applications requiring ultra-low power, low leakage or ultra-high performance.
Mobile Semiconductor has been in business for over 12 years. 100% of the design and support takes place inside the United States and the tools have zero open source software. Their customers include aerospace giants, medical device manufacturers, key semiconductor companies, and foundries supporting their customers.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Mobile Semiconductor's 22FDX Register File Memory Compiler Receives Globalfoundries Platinum Status
- eMemory and UMC Expand Low-Power Memory Solutions for AIoT and Mobile Markets with 22nm RRAM Qualification
- Mobile Semiconductor's 22nm ULL Memory compiler Joins the GLOBALFOUNDRIES FDXcelerator Partner program
- Arm Physical IP to Accelerate Mainstream Mobile and IoT SoC Designs on TSMC 22nm ULP/ULL Platform
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack