MIT, TI tip 28-nm processor
Mark LaPedus, EETimes
2/20/2011 9:05 PM EST
SAN FRANCISCO - At the 2011 International Solid-State Circuits Conference (ISSCC) here, Texas Instruments Inc. and the Massachusetts Institute of Technology (MIT) will outline what could be a major breakthrough in the gap between performance demands and battery capacity in the mobile space.
In a paper, TI and MIT will present research detailing design methodologies for a 28-nm mobile applications processor with ultra-low power. The paper-entitled ''A 28nm 0.6V Low Power Digital Signal Processor (DSP) for Mobile
To read the full article, click here
Related Semiconductor IP
- Simulation VIP for Ethernet UEC
- Bluetooth® Low Energy 6.2 PHY IP with Channel Sounding
- Simulation VIP for UALink
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- JPEG XL Encoder
Related News
- Improved ARM core, other changes in TI mobile app processor
- Express Logic's ThreadX RTOS Supports ARM and TI DSP Processors on Critical Link's MityDSP-L138F Board
- Cortus MINERVA Out-of-Order 4GHz 64-bit RISC-V Processor Platform targets automotive applications
- Ambient Scientific AI-native processor for edge applications offers 100x power and performance improvements over 32-bit MCUs
Latest News
- Mixel MIPI IP Integrated into Automotive Radar Processors Supporting Safety-critical Applications
- GlobalFoundries and Navitas Semiconductor Partner to Accelerate U.S. GaN Technology and Manufacturing for AI Datacenters and Critical Power Applications
- VLSI EXPERT selects Innatera Spiking Neural Processors to build industry-led neuromorphic talent pool
- SkyWater Technology and Silicon Quantum Computing Team to Advance Hybrid Quantum-Classical Computing
- Dnotitia Revolutionizes AI Storage at SC25: New VDPU Accelerator Delivers Up to 9x Performance Boost