MIPI Alliance Defines Analog Reference Interface for Envelope Tracking
PISCATAWAY, N.J.-- September 18, 2013 --The MIPI® Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announces the availability of its Analog Reference Interface for Envelope Tracking (eTrak) specification. eTrak is a multi-source vendor, independent interface that provides interoperability between multiple 3G/4G modem chipsets and Envelope Tracking Power Supplies (ETPS), enabling wide deployment of envelope tracking technology. By integrating eTrak into RF modem chipsets and ETPS, the specification allows modem ICs to control the supply voltage of RF power amplifiers, which improves the efficiency of the transmitter, one of the three large power consuming elements in a mobile device. Previous fixed proprietary alternatives did not allow manufacturers the benefits of an industry standard solution including improved efficiency and lower costs.
“MIPI’s eTrak specification benefits any 3G or 4G mobile device – cell phones, tablets, data cards, to name a few. We do expect the greatest benefit of envelope tracking to be in lowering power consumption and improving battery life for high data rates communications like LTE and LTE-Advanced,” said Joel Huloux, Board Chairman of MIPI Alliance. “We are already seeing modem vendors and ETPS vendors incorporating the specification into their products to ensure compatibility. OEMS have also expressed excitement for eTrak as well because it gives them flexibility in selecting components for their products and platforms.”
eTrak is unique in that unlike other MIPI specifications, it provides a full analog interface, not just a PHY. The eTrak specification, as with all MIPI Alliance specifications, is available for members to download from the MIPI Alliance website. eTrak is available under MIPI Alliance IP rules, which are considered by the mobile industry to be adopter-friendly and well-respected.
About MIPI
MIPI® Alliance (MIPI) develops interface specifications for mobile and mobile-influenced industries. Founded in 2003, the organization has more than 240 member companies worldwide, 12 active working groups and has delivered more than 30 specifications within the mobile ecosystem in the last decade. Members of the organization include handset manufacturers, device OEMs, software providers, semiconductor companies, application processor developers, IP tool providers, test and test equipment companies, as well as camera, tablet and laptop manufacturers. For more information, please visit www.mipi.org.
Related Semiconductor IP
- MIPI SoundWire I3S Peripheral IP
- MIPI SoundWire I3S Manager IP
- MIPI SWI3S Manager Core IP
- MIPI I3C Target Device
- MIPI CSI-2 IP
Related News
- MIPI Alliance Releases New Groundbreaking Audio Interface Specification for High-Bandwidth, Low-Latency Consumer Electronics, Automotive and Industrial Applications
- IEEE Adopts MIPI A-PHY, First Industry-Standard, Long-Reach SerDes Physical Layer Interface for Automotive Applications
- MIPI D-PHY v3.0 Doubles Data Rate of Physical Layer Interface While Extending Power Efficiency
- MIPI UFS v3.1 Ctrl., MIPI UniPro v1.8 Ctrl. & MIPI M-PHY v4.1 IP Cores in 12nm & 28nm available for immediate licensing for high performance serial interface applications
Latest News
- Mixel MIPI IP Integrated into Automotive Radar Processors Supporting Safety-critical Applications
- GlobalFoundries and Navitas Semiconductor Partner to Accelerate U.S. GaN Technology and Manufacturing for AI Datacenters and Critical Power Applications
- VLSI EXPERT selects Innatera Spiking Neural Processors to build industry-led neuromorphic talent pool
- SkyWater Technology and Silicon Quantum Computing Team to Advance Hybrid Quantum-Classical Computing
- Dnotitia Revolutionizes AI Storage at SC25: New VDPU Accelerator Delivers Up to 9x Performance Boost