Crypto Bugs in IEEE Standard Expose Intellectual Property in Plaintext
By Catalin Cimpanu, BleepingComputer
November 4, 2017
Due to the use of weak cryptography in the IEEE P1735 electronics standard, attackers can recover highly-valuable intellectual property in plaintext.
The Institute of Electrical and Electronics Engineers (IEEE) P1735 standard describes a series of methods and techniques for encrypting information about the hardware and software inner workings of chips, SoCs, integrated circuits, and other electronic equipment.
The standard is used to protect intellectual property (IP) for commercial electronic design and allows hardware and software vendors to mix their code together to create new products, while at the same time protecting their creation from reverse-engineering and IP theft.
In simpler words, IEEE P1735 is a DRM for low-level hardware components that allows code from different manufacturers to work together but remain encrypted.
Almost all hardware and software vendors use IEEE P1735 to protect their work, for obvious reasons.
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- IMEC realizes world's first digital UWB transmitter IC for IEEE 802.15.4a
- Duolog Technologies tapes out IEEE 802.15.4/Zigbee radio which offers significant time to market reductions for semiconductor customers
- IP Cores, Inc. Announces three low-latency Fast Fourier Transform IP cores for SoC applications in the OFDM-based communications (WiMAX, MBOA, IEEE 802.11) and GPS fields
- IEEE Forms Study Groups to Explore Creation of Standards Based on VSI Alliance Technology
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack