Flex Logix adoption expands into datacenters
EFLX® eFPGA Delivers Speedy Flexibility at Much Lower Cost and Power than FPGA
MOUNTAIN VIEW, Calif. – October 30, 2023 – Flex Logix® Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP, announced today that the first application using EFLX eFPGA for datacenters is in design.
More than 25 chips have been successfully fabricated in silicon using EFLX eFPGA with many more in design. Flex Logix now has more than 20 customers in total, including leading global customers Renesas, Datung and Boeing.
“Existing applications of eFPGA are in automotive, consumer, wireless communications, defense, fintech, security, and signal processing,” said Geoff Tate, CEO of Flex Logix. “Now eFPGA is also being adopted for a high volume datacenter application. Many datacenter applications require advanced nodes and >1 Million LUTs, which we now support with new process ports, an improved interconnect and a new eFPGA compiler.”
“FPGAs today are mainstream, used in high volume across many applications,” said Andy Jaros, VP of Sales at Flex Logix. “Our customers take advantage of the unique benefits of embedded FPGA technology to cut the size, cost, and power of FPGAs through integration into their SoCs or processors: cost and power are cut by 80-90% and area is cut by 50%; expensive components like voltage regulators are also reduced. Customers who have never used FPGAs are now aggressively adding eFPGA to give their chips the flexibility to adapt to changing standards, changing algorithms, avoid expensive mask spins, and to enable their customers to customize the chips for different end applications with one chip. The rate of customer evaluation and adoption of eFPGA is definitely accelerating.”
About Flex Logix®
Flex Logix is a reconfigurable computing company providing leading edge eFPGA and AI Inference technologies for semiconductor and systems companies. Flex Logix eFPGA enables volume FPGA users to integrate the FPGA into their companion SoC, resulting in a 5-10x reduction in the cost and power of the FPGA and increasing compute density which is critical for communications, networking, data centers, microcontrollers and others. Its scalable AI inference is the most efficient, providing much higher inference throughput per square millimeter and per watt. Flex Logix supports process nodes from 180nm to 7nm, with 5nm and 3nm in development. Flex Logix is headquartered in Mountain View, California and has an office in Austin, Texas. For more information, visit https://flex-logix.com.
Related Semiconductor IP
- eFPGA
- eFPGA on GlobalFoundries GF12LP
- Heterogeneous eFPGA architecture with LUTs, DSPs, and BRAMs on GlobalFoundries GF12LP
- eFPGA Soft IP
- Radiation-Hardened eFPGA
Related News
- Flex Logix Co-Founder Cheng Wang Awarded Interconnect Patent For Tiling of eFPGA Cores to Create Wide Range of Larger eFPGA Arrays
- Flex Logix Validates EFLX 4K eFPGA IP Core on TSMC16FFC; Evaluation Boards Available Now
- Flex Logix Co-Founders Awarded Interconnect Patent For Connecting Any Kind Of RAM Between eFPGA Cores To Create Application-Optimized eFPGA Arrays
- Flex Logix EFLX1K eFPGA Cores Enable Array-Efficient Reconfigurable Logic on 40nm to 180nm Nodes
Latest News
- Ceva Appoints Former Microsoft AI and Hardware Leader Yaron Galitzky to Accelerate Ceva’s AI Strategy and Innovation at the Smart Edge
- Dnotitia Unveils VDPU IP, the First Accelerator IP for Vector Database
- Ambient Scientific AI-native processor for edge applications offers 100x power and performance improvements over 32-bit MCUs
- Qualitas Semiconductor Signs PCIe Gen 4.0 PHY IP License Agreement with Leading Chinese Fabless Customer
- Signal Edge Solutions Joins AMD Embedded Partner Program